Texas Instruments warranty TMS320C6727, TMS320C6726, TMS320C6722, Features, DIT-CapableMcASP2

TMS320C6727, TMS320C6726, TMS320C6722

Floating-Point Digital Signal Processors

www.ti.com

SPRS268E –MAY 2005 –REVISED JANUARY 2007

1 TMS320C6727, TMS320C6726, TMS320C6722 DSPs

1.1 Features

∙C672x: 32-/64-Bit 300-MHz Floating-Point DSPs

∙Upgrades to C67x+ CPU From C67x™ DSP Generation:

–2X CPU Registers [64 General-Purpose]

–New Audio-Specific Instructions

–Compatible With the C67x CPU

∙Enhanced Memory System

–256K-Byte Unified Program/Data RAM

–384K-Byte Unified Program/Data ROM

–Single-Cycle Data Access From CPU

–Large Program Cache (32K Byte) Supports RAM, ROM, and External Memory

∙External Memory Interface (EMIF) Supports

–100-MHz SDRAM (16- or 32-Bit)

–Asynchronous NOR Flash, SRAM (8-,16-, or 32-Bit)

–NAND Flash (8- or 16-Bit)

∙Enhanced I/O System

–High-Performance Crossbar Switch

–Dedicated McASP DMA Bus

–Deterministic I/O Performance

∙dMAX (Dual Data Movement Accelerator) Supports:

–16 Independent Channels

–Concurrent Processing of Two Transfer Requests

–1-, 2-, and 3-Dimensional Memory-to-Memory and Memory-to-Peripheral Data Transfers

–Circular Addressing Where the Size of a Circular Buffer (FIFO) is not Limited to 2n

–Table-Based Multi-Tap Delay Read and Write Transfers From/To a Circular Buffer

∙Three Multichannel Audio Serial Ports

–Transmit/Receive Clocks up to 50 MHz

–Six Clock Zones and 16 Serial Data Pins

–Supports TDM, I2S, and Similar Formats

–DIT-Capable (McASP2)

∙Universal Host-Port Interface (UHPI)

–32-Bit-Wide Data Bus for High Bandwidth

–Muxed and Non-Muxed Address and Data

∙Two 10-MHz SPI Ports With 3-, 4-, and 5-Pin Options

∙Two Inter-Integrated Circuit (I2C) Ports

∙Real-Time Interrupt Counter/Watchdog

∙Oscillator- and Software-Controlled PLL

∙Applications:

–Professional Audio

∙Mixers

∙Effects Boxes

∙Audio Synthesis

∙Instrument/Amp Modeling

∙Audio Conferencing

∙Audio Broadcast

∙Audio Encoder

–Emerging Audio Applications

–Biometrics

–Medical

–Industrial

∙Commercial or Extended Temperature

∙144-Pin, 0.5-mm, PowerPAD™ Thin Quad Flatpack (TQFP) [RFP Suffix]

∙256-Terminal, 1.0-mm, 16x16 Array Plastic Ball Grid Array (PBGA) [GDH and ZDH Suffixes]

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this document.

C67x, PowerPAD, TMS320C6000, C6000, DSP/BIOS, XDS, TMS320 are trademarks of Texas Instruments. Philips is a registered trademark of Koninklijki Philips Electronics N.V.

All trademarks are the property of their respective owners.

PRODUCTION DATA information is current as of publication date.	Copyright © 2005–2007, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.