Texas Instruments warranty Mechanical Data, TMS320C6727, TMS320C6726, TMS320C6722

TMS320C6727, TMS320C6726, TMS320C6722

Floating-Point Digital Signal Processors

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SPRS268E –MAY 2005 –REVISED JANUARY 2007

7 Mechanical Data

7.1 Package Thermal Resistance Characteristics

Table 7-1and Table 7-2provide the thermal characteristics for the recommended package types used on the TMS320C672x DSP.

Table 7-1. Thermal Characteristics for GDH/ZDH Package

NO.			°C/W	AIR FLOW
				(m/s)
		Two-Signal, Two-Plane, 101.5 x 114.5 x 1.6 mm , 2-oz Cu. EIA/JESD51-9 PCB
1	RθJA	Thermal Resistance Junction to Ambient	25	0
2	RθJB	Thermal Resistance Junction to Board	14.5	0
3	RθJC	Thermal Resistance Junction to Top of Case	10	0
4	ΨJB	Thermal Metric Junction to Board	14	0
5	ΨJT	Thermal Metric Junction to Top of Case	0.39	0

Table 7-2. Thermal Characteristics for RFP Package

			THERMAL PAD CONFIGURATION			°C/W	AIR
NO.			TOP	BOTTOM	VIA		FLOW
					ARRAY		(m/s)
		Two-Signal, Two-Plane, 76.2 x 76.2 mm PCB(1)(2)(3)
1	RθJA	Thermal Resistance Junction to Ambient	10.6 x 10.6 mm	10.6 x 10.6 mm	6 x 6	20	0
			7.5 x 7.5 mm	7.5 x 7.5 mm	5 x 5	22	0
2	ΨJP	Thermal Metric Junction to Power Pad	10.6 x 10.6 mm	10.6 x 10.6 mm	6 x 6	0.39	0
		Double-Sided 76.2 x 76.2 mm PCB(1)(2)(4)
3	RθJA	Thermal Resistance Junction to Ambient	10.6 x 10.6 mm	10.6 x 10.6 mm	6 x 6	49	0
			10.6 x 10.6 mm	38.1 x 38.1 mm	6 x 6	27	0
			10.6 x 10.6 mm	57.2 x 57 mm	6 x 6	22	0
			10.6 x 10.6 mm	76.2 x 76.2 mm	6 x 6	20	0
4	ΨJP	Thermal Metric Junction to Power Pad	10.6 x 10.6 mm	10.6 x 10.6 mm	6 x 6	0.39	0

(1)PCB modeled with 2 oz/ft2 Top and Bottom Cu.

(2)Package thermal pad must be properly soldered to top layer PCB thermal pad for both thermal and electrical performance. Thermal pad is VSS.

(3)Top layer thermal pad is connected through via array to both bottom layer thermal pad and internal VSS plane.

(4)Top layer thermal pad is connected through via array to bottom layer thermal pad.

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