Texas Instruments warranty TMS320C6727, TMS320C6726, TMS320C6722, 7.2.1Standoff Height

TMS320C6727, TMS320C6726, TMS320C6722

Floating-Point Digital Signal Processors

www.ti.com

SPRS268E –MAY 2005 –REVISED JANUARY 2007

7.2 Supplementary Information About the 144-Pin RFP PowerPAD™ Package

7.2.1Standoff Height

This section highlights a few important details about the 144-pin RFP PowerPAD™ package. Texas Instruments'PowerPAD Thermally Enhanced Package Technical Brief (literature number SLMA002) should be consulted before designing a PCB for this device.

As illustrated in Figure 7-1, the standoff height specification for this device (between 0.050 mm and 0.150 mm) is measured from the seating plane established by the three lowest package pins to the lowest point on the package body. Due to warpage, the lowest point on the package body is located in the center of the package at the exposed thermal pad.

Using this definition of standoff height provides the correct result for determining the correct solder paste thickness. According to TI'sPowerPAD Thermally Enhanced Package Technical Brief (literature number SLMA002), the recommended range of solder paste thickness for this package is between 0.152 mm and 0.178 mm.

Standoff Height

Figure 7-1. Standoff Height Measurement on 144-Pin RFP Package

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