TMS320C6727, TMS320C6726, TMS320C6722

Floating-Point Digital Signal Processors

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SPRS268E –MAY 2005 –REVISED JANUARY 2007

7.2.2PowerPAD™ PCB Footprint

Texas Instruments' PowerPAD Thermally Enhanced Package Technical Brief (literature number SLMA002) should be consulted when creating a PCB footprint for this device. In general, for proper thermal performance, the thermal pad under the package body should be as large as possible. However, the soldermask opening for the PowerPAD™ should be sized to match the pad size on the 144-pin RFP package; as illustrated in Figure 7-2.

Thermal Pad on Top Copper

Soldermask opening should be smaller and match

should be as large as Possible.

the size of the thermal pad on the DSP.

Figure 7-2. Soldermask Opening Should Match Size of DSP Thermal Pad

7.3 Packaging Information

The following packaging information reflects the most current released data available for the designated device(s). This data is subject to change without notice and without revision of this document.

On the 144-pin RFP package, the actual size of the Thermal Pad is 5.4 mm × 5.4 mm.

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Mechanical Data

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Texas Instruments TMS320C6722, TMS320C6727, TMS320C6726 warranty PowerPAD PCB Footprint, Packaging Information