Emerson 2468CB, 2468CD manual 3b-10, 3b.3.1.7 Configuring the Delay Circuit Split Pads

Delay Relay Output Board Option Hydrastep 2468CB and 2468CD Manual

3b.3.1.7 Configuring the Delay Circuit Split Pads

WARNING Mains voltages are present in this instrument when power is connected. De-energise before opening front cover.

1.Isolate the 2468 electronics enclosure from its power supplies.

2.Split pad bridging may be carried out in-situ, however it may be easier to remove the board from the unit. Gain access to the delay relay output PCB and bridge the required split pads (see Table 3b.2 and Figure 3b.2) with solder, ensuring that the remaining split pads are open-circuit and clean.

3.Note: When two output boards are fitted, the upper board will have to be removed temporarily to give access to the split pads of the lower output board.

4.Carry out any necessary re-assembly on the output board(s) and test that the required delay on the relay operations is being achieved.

5.If no further work is required inside the enclosure, close and secure the enclosure lid.

Figure 3b.2 - View of delay relay output board showing split pad positions

Note: The following split pads must be set as follows:

For Delayed Operation of the

Nominated Relay:

RL1	SP21 bridged with solder
	SP15 open-circuited
RL2	SP22 bridged with solder
	SP20 open-circuited
RL3	SP23 bridged with solder
	SP1 open-circuited
RL4	SP24 bridged with solder
	SP6 open-circuited

For No Delayed Operation of the

Nominated Relay:

RL1	SP15 bridged with solder
	SP21 open-circuited
RL2	SP20 bridged with solder
	SP22 open-circuited
RL3	SP1 bridged with solder
	SP23 open-circuited
RL4	SP6 bridged with solder
	SP24 open-circuited

3b-10 24685034