Intel DBS1200V3RPS 1.1References, 1.2Definition of Terms

Introduction

1.1References

Material and concepts available in the following documents may be beneficial when reading this document.

Table 1-1. Reference Documents

Document	Location	Notes
Intel® Xeon® Processor E3-1200 Family Data Sheet Volume One	http://
	www.intel.com/
	Assets/PDF/
	datasheet/
	324970.pdf
Intel® Xeon® Processor E3-1200 Family Datasheet Volume Two	http://
	www.intel.com/
	Assets/PDF/
	datasheet/
	324971.pdf
Intel® Xeon® Processor E3-1200 Family Specification Update	http://
	www.intel.com/
	Assets/PDF/
	specupdate/
	324972.pdf
4-Wire Pulse Width Modulation (PWM) Controlled Fans	Available at http://
	www.formfactors.org/

1.2Definition of Terms

Table 1-2.	Terms and Descriptions (Sheet 1 of 2)
Term		Description
Bypass		Bypass is the area between a passive heatsink and any object that can act to form a duct. For this
		example, it can be expressed as a dimension away from the outside dimension of the fins to the nearest
		surface.
CTE		Coefficient of Thermal Expansion. The relative rate a material expands during a thermal event.
DTS		Digital Thermal Sensor reports a relative die temperature as an offset from TCC activation temperature.
FSC		Fan Speed Control
IHS		Integrated Heat Spreader: a component of the processor package used to enhance the thermal
		performance of the package. Component thermal solutions interface with the processor at the IHS surface.
ILM		Independent Loading Mechanism provides the force needed to seat the 1155-LGA land package onto the
		socket contacts.
PCH		Platform Controller Hub. The PCH is connected to the processor via the Direct Media Interface (DMI) and
		Intel® Flexible Display Interface (Intel® FDI).
LGA1155 socket		The processor mates with the system board through this surface mount, 1155-land socket.
PECI		The Platform Environment Control Interface (PECI) is a one-wire interface that provides a communication
		channel between Intel processor and chipset components to external monitoring devices.
ΨCA		Case-to-ambient thermal characterization parameter (psi). A measure of thermal solution performance
		using total package power. Defined as (TCASE – TLA) / Total Package Power. The heat source should always
		be specified for Ψ measurements.
ΨCS		Case-to-sink thermal characterization parameter. A measure of thermal interface material performance
		using total package power. Defined as (TCASE – TS) / Total Package Power.
ΨSA		Sink-to-ambient thermal characterization parameter. A measure of heatsink thermal performance using
		total package power. Defined as (TS – TLA) / Total Package Power.
TCASE or TC		The case temperature of the processor, measured at the geometric center of the topside of the TTV IHS.
10		Thermal/Mechanical Specifications and Design Guidelines