1U Thermal Solution

9.2.3Assembly

Figure 9-3. 1U Collaboration Heatsink Assembly

The assembly process for the 1U collaboration heatsink with application of thermal interface material begins with placing back plate in a fixture. The motherboard is aligned with fixture.

Next is to place the heatsink such that the heatsink fins are parallel to system airflow. While lowering the heatsink onto the IHS, align the four captive screws of the heatsink to the four holes of motherboard.

Using a #2 Phillips driver, torque the four captive screws to 8 inch-pounds.

This assembly process is designed to produce a static load compliant with the minimum preload requirement (26.7 lbf) for the selected TIM and to not exceed the package design limit (50 lbf).

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