1U Thermal Solution

9.3.3Assembly

The assembly process is same as the way described in Section 9.2.3, please refer to it for more details.

9.4Geometric Envelope for 1U Thermal Mechanical Design

Figure 9-5. KOZ 3-D Model (Top) in 1U Server

9.5mm Maximum Component Height (5 places)

1.6mm Maximum

2.07mm Maximum

Component Height

(2 places)

Component Height

 

(1 place)

2.5mm Maximum

1.2mm Maximum

Component Height

Component Height

(6 places)

(1 place)

9.5Thermal Interface Material

A thermal interface material (TIM) provides conductivity between the IHS and heatsink. The collaboration thermal solution uses Honeywell PCM45F, which pad size is

35x35 mm.

TIM should be verified to be within its recommended shelf life before use. Surfaces should be free of foreign materials prior to application of TIM.

9.6Heat Pipe Thermal Consideration

The following drawing shows the orientation and position of the 1155-land LGA Package TTV die, this is the same package layout as used in the 1156-land LGA Package TTV. The TTV die is sized and positioned similar to the production die.

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