Thermal Solution Quality and Reliability Requirements

11.2.1Recommended Test Sequence

Each test sequence should start with components (that is, baseboard, heatsink assembly, and so on) that have not been previously submitted to any reliability testing.

Prior to the mechanical shock & vibration test, the units under test should be preconditioned for 72 hours at 45 ºC. The purpose is to account for load relaxation during burn-in stage.

The test sequence should always start with a visual inspection after assembly, and BIOS/Processor/memory test. The stress test should be then followed by a visual inspection and then BIOS/Processor/memory test.

11.2.2Post-Test Pass Criteria

The post-test pass criteria are:

1.No significant physical damage to the heatsink and retention hardware.

2.Heatsink remains seated and its bottom remains mated flatly against the IHS surface. No visible gap between the heatsink base and processor IHS. No visible tilt of the heatsink with respect to the retention hardware.

3.No signs of physical damage on baseboard surface due to impact of heatsink.

4.No visible physical damage to the processor package.

5.Successful BIOS/Processor/memory test of post-test samples.

6.Thermal compliance testing to demonstrate that the case temperature specification can be met.

11.2.3Recommended BIOS/Processor/Memory Test Procedures

This test is to ensure proper operation of the product before and after environmental stresses, with the thermal mechanical enabling components assembled. The test shall be conducted on a fully operational baseboard that has not been exposed to any battery of tests prior to the test being considered.

Testing setup should include the following components, properly assembled and/or connected:

•Appropriate system baseboard.

•Processor and memory.

•All enabling components, including socket and thermal solution parts.

The pass criterion is that the system under test shall successfully complete the checking of BIOS, basic processor functions and memory, without any errors. Intel PC Diags is an example of software that can be utilized for this test.

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Thermal/Mechanical Specifications and Design Guidelines