Intel DBS1200V3RPS Contents

Contents

1	Introduction		..............................................................................................................	9
	1.1	References .......................................................................................................		10
	1.2	Definition of Terms ............................................................................................		10
2	Package Mechanical & Storage Specifications..........................................................			13
	2.1	Package Mechanical Specifications .......................................................................		13
		2.1.1	Package Mechanical Drawing....................................................................	14
		2.1.2 Processor Component Keep-Out Zones......................................................		14
		2.1.3	Package Loading Specifications ................................................................	15
		2.1.4	Package Handling Guidelines....................................................................	15
		2.1.5	Package Insertion Specifications...............................................................	15
		2.1.6	Processor Mass Specification....................................................................	15
		2.1.7	Processor Materials.................................................................................	16
		2.1.8	Processor Markings.................................................................................	16
		2.1.9	Processor Land Coordinates .....................................................................	17
	2.2	Processor Storage Specifications .........................................................................		18
3	LGA1155 Socket ......................................................................................................			19
	3.1	Board Layout ....................................................................................................		20
		3.1.1 Suggested Silkscreen Marking for Socket Identification................................		22
	3.2	Attachment to Motherboard ................................................................................		22
	3.3	Socket Components...........................................................................................		23
		3.3.1	Socket Body Housing ..............................................................................	23
		3.3.2	Solder Balls ...........................................................................................	23
		3.3.3	Contacts ...............................................................................................	23
		3.3.4 Pick and Place Cover...............................................................................		23
	3.4	Package Installation / Removal ...........................................................................		24
		3.4.1 Socket Standoffs and Package Seating Plane..............................................		25
	3.5	Durability .........................................................................................................		25
	3.6	Markings ..........................................................................................................		25
	3.7	Component Insertion Forces ...............................................................................		26
	3.8	Socket Size ......................................................................................................		26
4	Independent Loading Mechanism (ILM)...................................................................			27
	4.1	Design Concept.................................................................................................		27
		4.1.1 ILM Assembly Design Overview ................................................................		27
		4.1.2 ILM Back Plate Design Overview...............................................................		28
		4.1.3 Shoulder Screw and Fasteners Design Overview .........................................		29
	4.2	Assembly of ILM to a Motherboard.......................................................................		30
	4.3	ILM Interchangeability .......................................................................................		32
	4.4	Markings ..........................................................................................................		32
	4.5	ILM Cover ........................................................................................................		33
5	LGA1155 Socket and ILM Electrical, Mechanical and Environmental Specifications ..			37
	5.1	Component Mass...............................................................................................		37
	5.2	Package/Socket Stackup Height ..........................................................................		37
	5.3	Loading Specifications........................................................................................		38
	5.4	Electrical Requirements......................................................................................		38
	5.5	Environmental Requirements ..............................................................................		39
6	Thermal Specifications ............................................................................................			41
	6.1	Thermal Specifications .......................................................................................		41
		6.1.1 Intel® Xeon® Processor E3-1280 (95W)Thermal Profile................................		43
		6.1.2 Intel® Xeon® Processor E3-1200 (80W) Thermal Profile...............................		44
		6.1.3	Intel® Xeon® Processor E3-1260L (45W) Thermal Profile .............................	46

Thermal/Mechanical Specifications and Design Guideline