Contents

1

Introduction

..............................................................................................................

9

 

1.1

References .......................................................................................................

10

 

1.2

Definition of Terms ............................................................................................

10

2

Package Mechanical & Storage Specifications..........................................................

13

 

2.1

Package Mechanical Specifications .......................................................................

13

 

 

2.1.1

Package Mechanical Drawing....................................................................

14

 

 

2.1.2 Processor Component Keep-Out Zones......................................................

14

 

 

2.1.3

Package Loading Specifications ................................................................

15

 

 

2.1.4

Package Handling Guidelines....................................................................

15

 

 

2.1.5

Package Insertion Specifications...............................................................

15

 

 

2.1.6

Processor Mass Specification....................................................................

15

 

 

2.1.7

Processor Materials.................................................................................

16

 

 

2.1.8

Processor Markings.................................................................................

16

 

 

2.1.9

Processor Land Coordinates .....................................................................

17

 

2.2

Processor Storage Specifications .........................................................................

18

3

LGA1155 Socket ......................................................................................................

19

 

3.1

Board Layout ....................................................................................................

20

 

 

3.1.1 Suggested Silkscreen Marking for Socket Identification................................

22

 

3.2

Attachment to Motherboard ................................................................................

22

 

3.3

Socket Components...........................................................................................

23

 

 

3.3.1

Socket Body Housing ..............................................................................

23

 

 

3.3.2

Solder Balls ...........................................................................................

23

 

 

3.3.3

Contacts ...............................................................................................

23

 

 

3.3.4 Pick and Place Cover...............................................................................

23

 

3.4

Package Installation / Removal ...........................................................................

24

 

 

3.4.1 Socket Standoffs and Package Seating Plane..............................................

25

 

3.5

Durability .........................................................................................................

25

 

3.6

Markings ..........................................................................................................

25

 

3.7

Component Insertion Forces ...............................................................................

26

 

3.8

Socket Size ......................................................................................................

26

4

Independent Loading Mechanism (ILM)...................................................................

27

 

4.1

Design Concept.................................................................................................

27

 

 

4.1.1 ILM Assembly Design Overview ................................................................

27

 

 

4.1.2 ILM Back Plate Design Overview...............................................................

28

 

 

4.1.3 Shoulder Screw and Fasteners Design Overview .........................................

29

 

4.2

Assembly of ILM to a Motherboard.......................................................................

30

 

4.3

ILM Interchangeability .......................................................................................

32

 

4.4

Markings ..........................................................................................................

32

 

4.5

ILM Cover ........................................................................................................

33

5

LGA1155 Socket and ILM Electrical, Mechanical and Environmental Specifications ..

37

 

5.1

Component Mass...............................................................................................

37

 

5.2

Package/Socket Stackup Height ..........................................................................

37

 

5.3

Loading Specifications........................................................................................

38

 

5.4

Electrical Requirements......................................................................................

38

 

5.5

Environmental Requirements ..............................................................................

39

6

Thermal Specifications ............................................................................................

41

 

6.1

Thermal Specifications .......................................................................................

41

 

 

6.1.1 Intel® Xeon® Processor E3-1280 (95W)Thermal Profile................................

43

 

 

6.1.2 Intel® Xeon® Processor E3-1200 (80W) Thermal Profile...............................

44

 

 

6.1.3

Intel® Xeon® Processor E3-1260L (45W) Thermal Profile .............................

46

Thermal/Mechanical Specifications and Design Guideline

3