Thermal Specifications
6.1.7Thermal Metrology
The maximum TTV case temperatures
geometric top center of the TTV integrated heat spreader (IHS). Figure
Figure
Measure TCASE at
the geometric center of the package
7.53
37.5
Note: The following supplier can machine the groove and attach a thermocouple to the IHS. The supplier is listed below as a convenience to Intel’s general customers and the list may be subject to change without notice.
6.2Processor Thermal Features
6.2.1Processor Temperature
A new feature in the processors is a software readable field in the
IA32_TEMPERATURE_TARGET register that contains the minimum temperature at which the TCC will be activated and PROCHOT# will be asserted. The TCC activation temperature is calibrated on a
6.2.2Adaptive Thermal Monitor
The Adaptive Thermal Monitor feature provides an enhanced method for controlling the processor temperature when the processor silicon exceeds the Thermal Control Circuit (TCC) activation temperature. Adaptive Thermal Monitor uses TCC activation to reduce processor power via a combination of methods. The first method (Frequency/VID
54 | Thermal/Mechanical Specifications and Design Guidelines |