Thermal Specifications

6.1.7Thermal Metrology

The maximum TTV case temperatures (TCASE-MAX) can be derived from the data in the appropriate TTV thermal profile earlier in this chapter. The TTV TCASE is measured at the

geometric top center of the TTV integrated heat spreader (IHS). Figure 6-6illustrates the location where TCASE temperature measurements should be made. See Figure B-17for drawing showing the thermocouple attach to the TTV package.

Figure 6-6. TTV Case Temperature (TCASE) Measurement Location

Measure TCASE at

the geometric center of the package

7.53

37.5

Note: The following supplier can machine the groove and attach a thermocouple to the IHS. The supplier is listed below as a convenience to Intel’s general customers and the list may be subject to change without notice. THERM-X OF CALIFORNIA Inc, 3200 Investment Blvd., Hayward, Ca 94545. Ernesto B Valencia +1-510-441-7566 Ext. 242 ernestov@therm-x.com. The vendor part number is XTMS1565.

6.2Processor Thermal Features

6.2.1Processor Temperature

A new feature in the processors is a software readable field in the

IA32_TEMPERATURE_TARGET register that contains the minimum temperature at which the TCC will be activated and PROCHOT# will be asserted. The TCC activation temperature is calibrated on a part-by-part basis and normal factory variation may result in the actual TCC activation temperature being higher than the value listed in the register. TCC activation temperatures may change based on processor stepping, frequency or manufacturing efficiencies.

6.2.2Adaptive Thermal Monitor

The Adaptive Thermal Monitor feature provides an enhanced method for controlling the processor temperature when the processor silicon exceeds the Thermal Control Circuit (TCC) activation temperature. Adaptive Thermal Monitor uses TCC activation to reduce processor power via a combination of methods. The first method (Frequency/VID

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Thermal/Mechanical Specifications and Design Guidelines