98

Guidelines Design and Specifications Thermal/Mechanical

 

TOP SIDE

MAX LEVER MOTION SPACE

 

 

 

 

 

 

TO LEVER STOP

 

(R 65.21 )

( 15.16 )

 

 

7

 

 

 

 

MIN LEVER MOTION SPACE

 

(R 46.51 )

4.00

 

 

 

 

 

 

 

 

 

 

TO OPEN LID

 

 

 

 

 

 

 

 

8

 

 

 

6.55

 

1

 

3.75

 

 

 

 

 

 

 

 

 

 

 

 

 

1.25

 

 

CLEARANCE NEEDED

 

 

 

 

 

 

FOR WIRE TRAVEL

 

 

 

 

 

 

 

 

 

170.0

7

6.76

 

 

 

 

 

 

 

 

9.26

 

 

 

 

( 94.76 )

6.76

C

9.26

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

13.00

 

 

 

 

 

 

 

 

37.54

 

 

 

 

 

 

 

( 37.54 )

 

 

 

 

 

 

 

 

A

 

B

A

 

 

 

 

B

 

 

 

 

 

 

 

 

( 78.25 )

 

 

5

70.37

 

 

 

 

 

 

 

 

 

 

 

 

 

SEE DETAIL A

130.0

8

 

 

 

 

 

( 2.50 )

 

 

 

 

 

 

 

 

4.00

 

 

B

 

 

 

 

( 1.50 )

40.71 B

 

 

 

 

 

 

 

 

 

 

 

 

 

5.50

 

 

17.00

 

 

 

 

 

 

 

 

 

 

 

3X 6.34

 

 

 

 

 

 

 

 

 

 

 

8.97

LOAD PLATE OPENING

8.12

 

 

 

MOTION SPACE

2

 

 

 

 

 

 

 

 

 

 

 

 

 

3.18

 

8.97

 

 

 

 

 

 

3.18

 

15.92

 

 

 

 

 

 

19.50

 

 

 

 

 

 

 

 

51.00

 

 

 

 

 

 

 

 

 

 

42.50

 

 

 

C

 

8.12

2

 

 

 

 

 

 

 

 

 

 

 

 

 

C

 

 

 

 

2.50

21.25

 

 

1.75

 

 

 

 

 

 

7.00

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

LEVER UNLATCHED

 

SECTION A-A

 

 

 

 

 

POSITION

 

3X 2.58

 

 

 

 

NOTES:

 

 

3X

5.00

 

( 1.50 )

1 SOCKET CENTER PLANES ARE REFERENCED FROM GEOMETRIC

 

 

TYP PCB THICKNESS

 

 

 

 

CENTER OF SOCKET HOUSING CAVITY FOR CPU PACKAGE (ALIGNS

 

( 49.50 )

 

2.50

WITH DATUM REFERENCE GIVEN FOR BOARD COMPONENT KEEP-INS).

 

 

 

 

 

SECTION B-B

11.75

2 SOCKET KEEP-IN VOLUME VERTICAL HEIGHT ESTABLISHES LIMIT OF SOCKET

 

AND CPU PACKAGE ASSEMBLY IN THE SOCKET LOCKED DOWN POSITION.

IT ENCOMPASSES SOCKET AND CPU PACKAGE DIMENSIONAL TOLERANCES

AND DEFLECTION / SHAPE CHANGES DUE TO ILM LOAD.

3.SOCKET KEEP-IN VOLUME ENCOMPASS THE SOCKET NOMINAL VOLUME

AND ALLOWANCES FOR SIZE TOLERANCES. THERMAL/MECHANICAL COMPONENT DEVELOPERS SHALL DESIGN TO THE OUTSIDE OF SOCKET KEEP IN VOLUME WITH

CLEARANCE MARGINS. SOCKET DEVELOPERS SHALL DESIGN TO THE INSIDE VOLUME. 4.DIMENSIONS ARE IN MILLIMETERS

5NO COMPONENT BOUNDARY-FINGER ACCESS AREA

6 MOTHERBOARD BACKSIDE COMPONENT KEEP-IN

7 MAXIMUM OPEN ANGLE TO OPEN LOAD PLATE

8 MINIMUM OPEN ANGLE TO CLEAR LOAD PLATE

( 42.50 )

PRIMARY SIDE COMPONENT

CLEARANCE

C

SECONDARY SIDE COMPONENT CLEARANCE

( 42.50 )

B

19.99

27.33

6

78.25

12.29

18.72

6

 

49.50

3.75

BOTTOM SIDE

DEPARTMENT

2200 MISSION COLLEGE BLVD.

PST-TMI

P.O. BOX 58119

SANTA CLARA, CA 95052-8119

TITLE

LGA1156 & 1155 SOCKET,

ILM & PROCESSOR KEEPIN

SIZE

DRAWING NUMBER

 

REV

A1

 

E21320

 

J

SCALE: 1.000

DO NOT SCALE DRAWING

SHEET 1 OF 2

.3-B Figure

 

 

 

 

 

 

(Top) 1U for Side Primary Zone Keepout ILM / Processor / Socket

Mechanical

 

Drawings