Package Mechanical & Storage Specifications
2.1.7Processor MaterialsTable
Table
Component | Material |
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Integrated Heat Spreader (IHS) | Nickel Plated Copper |
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Substrate | Fiber Reinforced Resin |
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Substrate Lands | Gold Plated Copper |
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Figure
Figure
Sample (QDF):
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| GRP1LINE1: | i{M}{C}YY |
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| GRP1LINE2: | INTEL CONFIDENTIAL |
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| GRP1LINE3: | QDF ES SPEED |
GRP1LINE1 | GRP1LINE4: | COUNTRY OF ORIGIN | ||
GRP1LINE5: {FPO} {e4} | ||||
GRP1LINE2 |
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GRP1LINE3 | Production (SSPEC): | |||
GRP1LINE4 | ||||
GRP1LINE5 | GRP1LINE1: i{M}{C}YY | |||
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| GRP1LINE2: BRAND PROC# | |
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| GRP1LINE3: SSPEC SPEED | |
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| S/N | GRP1LINE4: | COUNTRY OF ORIGIN |
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GRP1LINE5: {FPO} {e4}
16 | Thermal/Mechanical Specifications and Design Guidelines |