Package Mechanical & Storage Specifications

2.1.7Processor Materials

Table 2-3lists some of the package components and associated materials.

Table 2-3. Processor Materials

Component

Material

 

 

Integrated Heat Spreader (IHS)

Nickel Plated Copper

 

 

Substrate

Fiber Reinforced Resin

 

 

Substrate Lands

Gold Plated Copper

 

 

2.1.8Processor Markings

Figure 2-3shows the topside markings on the processor. This diagram is to aid in the identification of the processor.

Figure 2-3. Processor Top-Side Markings

Sample (QDF):

 

 

 

GRP1LINE1:

i{M}{C}YY

 

 

 

GRP1LINE2:

INTEL CONFIDENTIAL

 

 

 

GRP1LINE3:

QDF ES SPEED

GRP1LINE1

GRP1LINE4:

COUNTRY OF ORIGIN

GRP1LINE5: {FPO} {e4}

GRP1LINE2

 

 

GRP1LINE3

Production (SSPEC):

GRP1LINE4

GRP1LINE5

GRP1LINE1: i{M}{C}YY

 

 

 

 

 

 

GRP1LINE2: BRAND PROC#

 

 

 

GRP1LINE3: SSPEC SPEED

 

 

S/N

GRP1LINE4:

COUNTRY OF ORIGIN

 

 

 

 

 

 

 

 

 

 

GRP1LINE5: {FPO} {e4}

16

Thermal/Mechanical Specifications and Design Guidelines