Package Mechanical & Storage Specifications

2.1.3Package Loading Specifications

Table 2-1provides dynamic and static load specifications for the processor package. These mechanical maximum load limits should not be exceeded during heatsink assembly, shipping conditions, or standard use condition. Also, any mechanical system or component testing should not exceed the maximum limits. The processor package substrate should not be used as a mechanical reference or load-bearing surface for thermal and mechanical solution.

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Table 2-1. Processor Loading Specifications

Parameter

Minimum

Maximum

Notes

 

 

 

 

Static Compressive Load

-

600 N [135 lbf]

1, 2, 3

 

 

 

 

Dynamic Compressive Load

-

712 N [160 lbf]

1, 3, 4

 

 

 

 

Notes:

1.These specifications apply to uniform compressive loading in a direction normal to the processor IHS.

2.This is the maximum static force that can be applied by the heatsink and retention solution to maintain the heatsink and processor interface.

3.These specifications are based on limited testing for design characterization. Loading limits are for the package only and do not include the limits of the processor socket.

4.Dynamic loading is defined as an 50g shock load, 2X Dynamic Acceleration Factor with a 500g maximum thermal solution.

2.1.4Package Handling Guidelines

Table 2-2includes a list of guidelines on package handling in terms of recommended maximum loading on the processor IHS relative to a fixed substrate. These package handling loads may be experienced during heatsink removal.

Table 2-2. Package Handling Guidelines

Parameter

Maximum Recommended

Notes

 

 

 

Shear

311 N [70 lbf]

1, 4

 

 

 

Tensile

111 N [25 lbf]

2, 4

 

 

 

Torque

3.95 N-m [35 lbf-in]

3, 4

 

 

 

Notes:

1.A shear load is defined as a load applied to the IHS in a direction parallel to the IHS top surface.

2.A tensile load is defined as a pulling load applied to the IHS in a direction normal to the IHS surface.

3.A torque load is defined as a twisting load applied to the IHS in an axis of rotation normal to the IHS top surface.

4.These guidelines are based on limited testing for design characterization.

2.1.5Package Insertion Specifications

The processor can be inserted into and removed from an LGA1155 socket 15 times. The socket should meet the LGA1155 socket requirements detailed in Chapter 5.

2.1.6Processor Mass Specification

The typical mass of the processor is 21.5 g (0.76 oz). This mass [weight] includes all the components that are included in the package.

Thermal/Mechanical Specifications and Design Guidelines

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