Package Mechanical & Storage Specifications
2.1.3Package Loading SpecificationsTable
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Table
Parameter | Minimum | Maximum | Notes |
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Static Compressive Load | - | 600 N [135 lbf] | |
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Dynamic Compressive Load | - | 712 N [160 lbf] | |
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Notes:
1.These specifications apply to uniform compressive loading in a direction normal to the processor IHS.
2.This is the maximum static force that can be applied by the heatsink and retention solution to maintain the heatsink and processor interface.
3.These specifications are based on limited testing for design characterization. Loading limits are for the package only and do not include the limits of the processor socket.
4.Dynamic loading is defined as an 50g shock load, 2X Dynamic Acceleration Factor with a 500g maximum thermal solution.
2.1.4Package Handling GuidelinesTable
Table
Parameter | Maximum Recommended | Notes |
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Shear | 311 N [70 lbf] | |
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Tensile | 111 N [25 lbf] | |
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Torque | 3.95 | |
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Notes:
1.A shear load is defined as a load applied to the IHS in a direction parallel to the IHS top surface.
2.A tensile load is defined as a pulling load applied to the IHS in a direction normal to the IHS surface.
3.A torque load is defined as a twisting load applied to the IHS in an axis of rotation normal to the IHS top surface.
4.These guidelines are based on limited testing for design characterization.
2.1.5Package Insertion SpecificationsThe processor can be inserted into and removed from an LGA1155 socket 15 times. The socket should meet the LGA1155 socket requirements detailed in Chapter 5.
2.1.6Processor Mass SpecificationThe typical mass of the processor is 21.5 g (0.76 oz). This mass [weight] includes all the components that are included in the package.
Thermal/Mechanical Specifications and Design Guidelines | 15 |