Intel DBS1200V3RPS 3.5Durability, 3.6Markings, 3.4.1Socket Standoffs and Package Seating Plane

LGA1155 Socket

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Figure 3-7. Package Installation / Removal Features

Package	Orientation
Pin 1	Notch
Indicator	(2 Places)

	Finger/Tool
	Access
Alignment	(2 Places)
Post	Pin 1
(2 Places)	Chamfer

3.4.1Socket Standoffs and Package Seating Plane

Standoffs on the bottom of the socket base establish the minimum socket height after solder reflow and are specified in Appendix C.

Similarly, a seating plane on the topside of the socket establishes the minimum package height. See Section 5.2 for the calculated IHS height above the motherboard.

3.5Durability

The socket must withstand 20 cycles of processor insertion and removal. The max chain contact resistance from Table 5-4must be met when mated in the 1st and 20th cycles.

The socket Pick and Place cover must withstand 15 cycles of insertion and removal.

3.6Markings

There are three markings on the socket:

•LGA1155: Font type is Helvetica Bold - minimum 6 point (2.125 mm). This mark will also appear on the pick and place cap.

•Manufacturer's insignia (font size at supplier's discretion).

•Lot identification code (allows traceability of manufacturing date and location).

Thermal/Mechanical Specifications and Design Guidelines 25