Sensor Based Thermal Specification Design Guidance
8.2Sensor Based Thermal Specification
The sensor based thermal specification consists of two parts. The first is a thermal profile that defines the maximum TTV TCASE as a function of TTV power dissipation. The thermal profile defines the boundary conditions for validation of the thermal solution.
The second part is a defined thermal solution performance (ΨCA) as a function of the
DTS value as reported over the PECI bus when DTS is greater than TCONTROL. This defines the operational limits for the processor using the TTV validated thermal
solution.
8.2.1TTV Thermal Profile
For the sensor based specification, the only reference made to a case temperature measurement is on the TTV. Functional thermal validation will not require the user to apply a thermocouple to the processor package or measure processor power.
Note: All functional compliance testing will be based on fan speed response to the reported
DTS values above TCONTROL. As a result, no conversion of TTV TCASE to processor TCASE will be necessary.
A knowledge of the system boundary conditions is necessary to perform the heatsink validation. Section 8.3.1 will provide more detail on defining the boundary conditions. The TTV is placed in the socket and powered to the recommended value to simulate the TDP condition. See Figure
Figure
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