Intel DBS1200V3RPS 2.2Processor Storage Specifications

Package Mechanical & Storage Specifications

2.2Processor Storage Specifications

Table 2-4includes a list of the specifications for device storage in terms of maximum and minimum temperatures and relative humidity. These conditions should not be exceeded in storage or transportation.

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Table 2-4. Storage Conditions

Parameter	Description	Min	Max	Notes
TABSOLUTE STORAGE	The non-operating device storage temperature.	-55 °C	125 °C	1, 2, 3
	Damage (latent or otherwise) may occur when
	subjected to for any length of time.
TSUSTAINED STORAGE	The ambient storage temperature limit (in	-5 °C	40 °C	4, 5
	shipping media) for a sustained period of time.
RHSUSTAINED STORAGE	The maximum device storage relative humidity	60% @ 24 °C		5, 6
	for a sustained period of time.
TIMESUSTAINED STORAGE	A prolonged or extended period of time; typically	0	6	6
	associated with customer shelf life.	Months	Months

Notes:

1.Refers to a component device that is not assembled in a board or socket that is not to be electrically connected to a voltage reference or I/O signals.

2.Specified temperatures are based on data collected. Exceptions for surface mount reflow are specified in by applicable JEDEC standard Non-adherence may affect processor reliability.

3.TABSOLUTE STORAGE applies to the unassembled component only and does not apply to the shipping media, moisture barrier bags or desiccant.

4.Intel branded board products are certified to meet the following temperature and humidity limits that are given as an example only (Non-Operating Temperature Limit: -40 °C to 70 °C, Humidity: 50% to 90%, non-condensing with a maximum wet bulb of 28 °C). Post board attach storage temperature limits are not specified for non-Intel branded boards.

5.The JEDEC, J-JSTD-020 moisture level rating and associated handling practices apply to all moisture sensitive devices removed from the moisture barrier bag.

6.Nominal temperature and humidity conditions and durations are given and tested within the constraints imposed by TSUSTAINED STORAGE and customer shelf life in applicable intel box and bags.

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18 Thermal/Mechanical Specifications and Design Guidelines