Intel DBS1200V3RPS 11Thermal Solution Quality and Reliability Requirements, 11.1Reference Heatsink Thermal Verification, 11.2Mechanical Environmental Testing

Thermal Solution Quality and Reliability Requirements

11Thermal Solution Quality and Reliability Requirements

11.1Reference Heatsink Thermal Verification

Each motherboard, heatsink and attach combination may vary the mechanical loading of the component. Based on the end user environment, the user should define the appropriate reliability test criteria and carefully evaluate the completed assembly prior to use in high volume. The Intel reference thermal solution will be evaluated to the boundary conditions in Chapter 5.

The test results, for a number of samples, are reported in terms of a worst-case mean

+ 3σ value for thermal characterization parameter using the TTV.

11.2Mechanical Environmental Testing

Each motherboard, heatsink and attach combination may vary the mechanical loading of the component. Based on the end user environment, the user should define the appropriate reliability test criteria and carefully evaluate the completed assembly prior to use in high volume. Some general recommendations are shown in Table 11-1.

The Intel reference heatsinks will be tested in an assembled to the LGA1155 socket and mechanical test package. Details of the Environmental Requirements, and associated stress tests, can be found in Table 11-1are based on speculative use condition assumptions, and are provided as examples only.

Table 11-1. Use Conditions (Board Level)

Test1	Requirement	Pass/Fail Criteria2
Mechanical Shock	3 drops each for + and - directions in each of 3	Visual Check and
	perpendicular axes (that is, total 18 drops)	Electrical Functional
	Profile: 50 g, Trapezoidal waveform, 4.3 m/s [170 in/s]	Test
	minimum velocity change
Random Vibration	Duration: 10 min/axis, 3 axes	Visual Check and
	Frequency Range: 5 Hz to 500 Hz	Electrical Functional
	5 Hz @ 0.01 g2/Hz to 20 Hz @ 0.02 g2/Hz (slope up)	Test
	20 Hz to 500 Hz @ 0.02 g2/Hz (flat)
	Power Spectral Density (PSD) Profile: 3.13 g RMS
Thermal Cycling	–25°C to +100°C;Ramp rate ~ 8C/minute; Cycle time:~30	Visual Check and
	minutes per cycle for 500 cycles.	Thermal Performance
		Test

Notes:

1.It is recommended that the above tests be performed on a sample size of at least ten assemblies from multiple lots of material.

2.Additional pass/fail criteria may be added at the discretion of the user.

Thermal/Mechanical Specifications and Design Guidelines 89