Introduction
Table | Terms and Descriptions (Sheet 2 of 2) | |
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Term |
| Description |
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TCASE_MAX |
| The maximum case temperature as specified in a component specification. |
TCC |
| Thermal Control Circuit: Thermal monitor uses the TCC to reduce the die temperature by using clock |
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| modulation and/or operating frequency and input voltage adjustment when the die temperature is very |
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| near its operating limits. |
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TCONTROL |
| Tcontrol is a static value that is below the TCC activation temperature and used as a trigger point for fan |
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| speed control. When DTS > Tcontrol, the processor must comply to the TTV thermal profile. |
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TDP |
| Thermal Design Power: Thermal solution should be designed to dissipate this target power level. TDP is not |
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| the maximum power that the processor can dissipate. |
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Thermal Monitor |
| A power reduction feature designed to decrease temperature after the processor has reached its maximum |
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| operating temperature. |
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Thermal Profile |
| Line that defines case temperature specification of the TTV at a given power level. |
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TIM |
| Thermal Interface Material: The thermally conductive compound between the heatsink and the processor |
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| case. This material fills the air gaps and voids, and enhances the transfer of the heat from the processor |
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| case to the heatsink. |
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TTV |
| Thermal Test Vehicle. A mechanically equivalent package that contains a resistive heater in the die to |
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| evaluate thermal solutions. |
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TLA |
| The measured ambient temperature locally surrounding the processor. The ambient temperature should be |
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| measured just upstream of a passive heatsink or at the fan inlet for an active heatsink. |
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TSA |
| The system ambient air temperature external to a system chassis. This temperature is usually measured |
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| at the chassis air inlets. |
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| § | |
Thermal/Mechanical Specifications and Design Guidelines | 11 |