Independent Loading Mechanism (ILM)

Figure 4-1. ILM Assembly with Installed Processor

Hinge /

 

Frame

 

Assy

Fasteners

Load

LoadLever

Plate

Pin 1 Indicator

Shoulder Screw

4.1.2ILM Back Plate Design Overview

The back plate is a flat steel back plate with pierced and extruded features for ILM attach. A clearance hole is located at the center of the plate to allow access to test points and backside capacitors if required. An insulator is pre-applied. A notch is placed in one corner to assist in orienting the back plate during assembly.

Note: The Server ILM back plate is different from the Desktop design. Since Server secondary-side clearance of 3.0 mm [0.118 inch] is generally available for leads and backside components, so Server ILM back plate is designed with 1.8 mm thickness and 2.2 mm entire height including punch protrusion length.

Caution: Intel does NOT recommend using the server back plate for high-volume desktop applications at this time as the server back plate test conditions cover a limited envelope. Back plates and screws are similar in appearance. To prevent mixing, different levels of differentiation between server and desktop back plate and screws have been implemented.

For ILM back plate, three levels of differentiation have been implemented:

•Unique part numbers, please refer to part numbers listed in Appendix A.

•Desktop ILM back plate to use black lettering for marking versus server ILM back plate to use yellow lettering for marking.

•Desktop ILM back plate using marking “115XDBP” versus server ILM back plate using marking “115XSBP”.

Note: When reworking a BGA component or the socket that the heatsink, battery, ILM and ILM Back Plate are removed prior to rework. The ILM back plate should also be removed when reworking through hole mounted components in a mini-wave or solder pot). The maximum temperature for the pre-applied insulator on the ILM is approximately 106 °C.

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Thermal/Mechanical Specifications and Design Guidelines