Thermal Specifications

Section 6.2. To ensure maximum flexibility for future processors, systems should be designed to the Thermal Solution Capability guidelines, even if a processor with lower power dissipation is currently planned.

Table 6-1. Processor Thermal Specifications

 

 

Max

Max

Max

TTV

Min TCASE

Maximum

 

Guidelines8

Power

Power

Power

Thermal

Product

Package

Package

Package

Design

(°C)

TTV TCASE

 

 

C1E

C3

C6

Power

 

(°C)

 

 

(W)1,2,6

(W)1,2,6

(W)1,3,6

(W)4,5,7

 

 

Intel® Xeon®

 

 

 

 

 

 

Figure 6-1

Processor E3-

2011D

28

22

5.5

95

 

 

&Table 6-2

1280 (95W)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Intel® Xeon®

 

 

 

 

 

 

Figure 6-2&

processor E3-

2011D

28

22

5.5

80

 

 

Table 6-3

1200 (80W)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Intel® Xeon®

 

 

 

 

 

 

Figure 6-3&

processor E3-

2011B

20

12

5.5

45

 

5

Table 6-4

1260L (45W)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Intel® Xeon®

 

 

 

 

 

 

Figure 6-4&

processor E3-

2011A

18

10

5

20

 

 

Table 6-5

1220L (20W)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Intel® Xeon®

 

 

 

 

 

 

 

processor E3-

 

 

 

 

 

 

Figure 6-5&

1200 (95W)

2011D

28

22

5.5

95

 

 

Table 6-6

with integrated

 

 

 

 

 

 

 

 

 

 

 

 

 

graphics

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Notes:

1.The package C-state power is the worst case power in the system configured as follows:

-Memory configured for DDR3 1333 and populated with 2 DIMM per channel.

-DMI and PCIe links are at L1.

2.Specification at Tj of 50 °C and minimum voltage loadline.

3.Specification at Tj of 35 °C and minimum voltage loadline.

4.These values are specified at VCC_MAX and VNOM for all other voltage rails for all processor frequencies. Systems must be designed to ensure the processor is not to be subjected to any static VCC and ICC combination wherein VCCP exceeds VCCP_MAX at specified ICCP. Please refer to the loadline specifications in the datasheet.

5.Thermal Design Power (TDP) should be used for processor thermal solution design targets. TDP is not the maximum power that the processor can dissipate. TDP is measured at DTS = -1.

TDP is achieved with the Memory configured for DDR3 1333 and 2 DIMMs per channel.

6.Not 100% tested. Specified by design characterization.

7.When the Multi-monitor feature is enabled (running 4 displays simultaneously) there could be corner cases with additional system thermal impact on the SA and VCCP rails ≤1.5W (maximum of 1.5W measured on 16 lane PCIe card). The integrator should perform additional thermal validation with Multi-monitor enabled to ensure thermal compliance.

8.Guidelines provide a design target for meeting all planned processor frequency requirements. For more detailed definition, please refer to latest processor Datasheet.

42

Thermal/Mechanical Specifications and Design Guidelines