Thermal Specifications
Section 6.2. To ensure maximum flexibility for future processors, systems should be designed to the Thermal Solution Capability guidelines, even if a processor with lower power dissipation is currently planned.
Table
|
| Max | Max | Max | TTV | Min TCASE | Maximum | |
| Guidelines8 | Power | Power | Power | Thermal | |||
Product | Package | Package | Package | Design | (°C) | TTV TCASE | ||
|
| C1E | C3 | C6 | Power |
| (°C) | |
|
| (W)1,2,6 | (W)1,2,6 | (W)1,3,6 | (W)4,5,7 |
|
| |
Intel® Xeon® |
|
|
|
|
|
| ||
Processor E3- | 2011D | 28 | 22 | 5.5 | 95 |
| ||
| ||||||||
1280 (95W) |
|
|
|
|
|
| ||
|
|
|
|
|
|
| ||
|
|
|
|
|
|
|
| |
Intel® Xeon® |
|
|
|
|
|
| ||
processor E3- | 2011D | 28 | 22 | 5.5 | 80 |
| ||
| ||||||||
1200 (80W) |
|
|
|
|
|
| ||
|
|
|
|
|
|
| ||
|
|
|
|
|
|
|
| |
Intel® Xeon® |
|
|
|
|
|
| ||
processor E3- | 2011B | 20 | 12 | 5.5 | 45 |
| ||
5 | ||||||||
1260L (45W) |
|
|
|
|
| |||
|
|
|
|
|
| |||
|
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|
|
|
| |
Intel® Xeon® |
|
|
|
|
|
| ||
processor E3- | 2011A | 18 | 10 | 5 | 20 |
| ||
| ||||||||
1220L (20W) |
|
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|
|
| ||
|
|
|
|
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| ||
|
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|
|
|
|
| |
Intel® Xeon® |
|
|
|
|
|
|
| |
processor E3- |
|
|
|
|
|
| ||
1200 (95W) | 2011D | 28 | 22 | 5.5 | 95 |
| ||
| ||||||||
with integrated |
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| ||
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|
|
|
| ||
graphics |
|
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| |
|
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|
|
Notes:
1.The package
-Memory configured for DDR3 1333 and populated with 2 DIMM per channel.
-DMI and PCIe links are at L1.
2.Specification at Tj of 50 °C and minimum voltage loadline.
3.Specification at Tj of 35 °C and minimum voltage loadline.
4.These values are specified at VCC_MAX and VNOM for all other voltage rails for all processor frequencies. Systems must be designed to ensure the processor is not to be subjected to any static VCC and ICC combination wherein VCCP exceeds VCCP_MAX at specified ICCP. Please refer to the loadline specifications in the datasheet.
5.Thermal Design Power (TDP) should be used for processor thermal solution design targets. TDP is not the maximum power that the processor can dissipate. TDP is measured at DTS =
TDP is achieved with the Memory configured for DDR3 1333 and 2 DIMMs per channel.
6.Not 100% tested. Specified by design characterization.
7.When the
8.Guidelines provide a design target for meeting all planned processor frequency requirements. For more detailed definition, please refer to latest processor Datasheet.
42 | Thermal/Mechanical Specifications and Design Guidelines |