Intel DBS1200V3RPS manual Figures

11	Thermal Solution Quality and Reliability Requirements............................................			89
	11.1	Reference Heatsink Thermal Verification...............................................................		89
	11.2	Mechanical Environmental Testing .......................................................................		89
		11.2.1	Recommended Test Sequence..................................................................	90
		11.2.2	Post-Test Pass Criteria ............................................................................	90
		11.2.3	Recommended BIOS/Processor/Memory Test Procedures .............................	90
	11.3	Material and Recycling Requirements ...................................................................		91
A	Component Suppliers...............................................................................................			93
B	Mechanical Drawings...............................................................................................			95
C	Socket Mechanical Drawings .................................................................................			115
D	Package Mechanical Drawings ...............................................................................			121

Figures

2-1 Processor Package Assembly Sketch ....................................................................		13
2-2	Package View ...................................................................................................	14
2-3	Processor Top-Side Markings ..............................................................................	16
2-4 Processor Package Lands Coordinates ..................................................................		17
3-1 LGA1155 Socket with Pick and Place Cover ...........................................................		19
3-2 LGA1155 Socket Contact Numbering (Top View of Socket)......................................		20
3-3 LGA1155 Socket Land Pattern (Top View of Board) ................................................		21
3-4	Suggested Board Marking...................................................................................	22
3-5	Attachment to Motherboard ................................................................................	22
3-6 Pick and Place Cover..........................................................................................		24
3-7 Package Installation / Removal Features...............................................................		25
4-1 ILM Assembly with Installed Processor .................................................................		28
4-2	Back Plate ........................................................................................................	29
4-3	Shoulder Screw.................................................................................................	30
4-4	ILM Assembly ...................................................................................................	31
4-5 Pin1 and ILM Lever............................................................................................		32
4-6	ILM Cover ........................................................................................................	34
4-7 ILM Cover and PnP Cover Interference .................................................................		35
5-1 Flow Chart of Knowledge-Based Reliability Evaluation Methodology ..........................		40
6-1 Thermal Test Vehicle Thermal Profile for Intel® Xeon® Processor E3-1280 (95W) .......		43
6-2 Thermal Test Vehicle Thermal Profile for Intel® Xeon® Processor E3-1200 (80W) .......		44
6-3 Thermal Test Vehicle Thermal Profile for Intel® Xeon® Processor E3-1260L (45W) .....		46
6-4 Thermal Test Vehicle Thermal Profile for Intel® Xeon® Processor E3-1220L (20W)		.... 47
6-5 Thermal Test Vehicle Thermal Profile for
	Intel® Xeon® Processor E3-1200 (95W) with Integrated Graphics ............................	48
6-6 TTV Case Temperature (TCASE) Measurement Location ..........................................		54
6-7 Frequency and Voltage Ordering..........................................................................		56
6-8	Package Power Control.......................................................................................	61
8-1 Comparison of Case Temperature vs. Sensor Based Specification.............................		66
8-2	Intel® Xeon® Processor E3-1280 (95W) TTV Thermal Profile .................................	67
8-3 DTS 1.1 Definition Points....................................................................................		72
9-1 1U Collaboration Heatsink Performance Curves......................................................		76
9-2 1U Collaboration Heatsink Performance Curves......................................................		77
9-3 1U Collaboration Heatsink Assembly ....................................................................		79
9-4 1U Reference Heatsink Performance Curves ..........................................................		80
9-5 KOZ 3-D Model (Top) in 1U Server ......................................................................		81
9-6 TTV Die Size and Orientation ..............................................................................		82

Thermal/Mechanical Specifications and Design Guideline 5