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LGA1155 Socket
All markings must withstand 260 °C for 40 seconds (typical reflow/rework profile) without degrading, and must be visible after the socket is mounted on the motherboard.
LGA1155 and the manufacturer's insignia are molded or laser marked on the side wall.
3.7Component Insertion Forces
Any actuation must meet or exceed SEMI
3.8Socket Size
Socket information needed for motherboard design is given in Appendix C.
This information should be used in conjunction with the reference motherboard keep- out drawings provided in Appendix B to ensure compatibility with the reference thermal mechanical components.
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26 | Thermal/Mechanical Specifications and Design Guidelines |