Package Mechanical & Storage Specifications

2Package Mechanical & Storage Specifications

2.1Package Mechanical Specifications

The processor is packaged in a Flip-Chip Land Grid Array package that interfaces with the motherboard via the LGA1155 socket. The package consists of a processor mounted on a substrate land-carrier. An integrated heat spreader (IHS) is attached to the package substrate and core and serves as the mating surface for processor thermal solutions, such as a heatsink. Figure 2-1shows a sketch of the processor package components and how they are assembled together. Refer to Chapter 3 and Chapter 4 for complete details on the LGA1155 socket.

The package components shown in Figure 2-1include the following:

1.Integrated Heat Spreader (IHS)

2.Thermal Interface Material (TIM)

3.Processor core (die)

4.Package substrate

5.Capacitors

Figure 2-1. Processor Package Assembly Sketch

Core (die)

TIM

IHS

 

Substrate

Capacitors

LGA1155 Socket

System Board

Note:

1.Socket and motherboard are included for reference and are not part of processor package.

2.For clarity the ILM not shown.

Thermal/Mechanical Specifications and Design Guidelines

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