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Package Mechanical & Storage Specifications
2Package Mechanical & Storage Specifications
2.1Package Mechanical Specifications
The processor is packaged in a
The package components shown in Figure
1.Integrated Heat Spreader (IHS)
2.Thermal Interface Material (TIM)
3.Processor core (die)
4.Package substrate
5.Capacitors
Figure
Core (die) | TIM |
IHS |
|
Substrate
Capacitors
LGA1155 Socket
System Board
Note:
1.Socket and motherboard are included for reference and are not part of processor package.
2.For clarity the ILM not shown.
Thermal/Mechanical Specifications and Design Guidelines | 13 |