1U Thermal Solution

Table 9-2. Comparison between TTV Thermal Profile and Thermal Solution Performance for Intel® Xeon® Processor E3-1280 (95W) (Sheet 2 of 2)

 

 

Thermal

Power (W)

TTV TCASE_MAX

Solution

 

(°C)

TCASE_MAX

 

 

(°C)

 

 

 

36

55.9

51.5

 

 

 

38

56.5

52.1

 

 

 

40

57.1

52.8

 

 

 

42

57.7

53.4

 

 

 

44

58.3

54.0

 

 

 

46

58.9

54.7

 

 

 

48

59.5

55.3

 

 

 

Power (W)

TTV TCASE_MAX

Thermal

Solution

 

(°C)

TCASE_MAX (°C)

 

 

86

70.9

67.4

 

 

 

88

71.5

68.1

 

 

 

90

72.1

68.7

 

 

 

92

72.7

69.3

 

 

 

94

73.3

70.0

 

 

 

95

73.6

70.3

 

 

 

 

 

 

9.2.2Thermal Solution

The collaboration thermal solution consists of two assemblies: heatsink assembly & back plate.

Heatsink is designed with the Aluminum base and Aluminum stack fin, which volumetrically is 95x95x24.85 mm. The heatpipe technology is used in the heatsink to improve thermal conduction.

Heatsink back plate is a 1.8 mm thick flat steel plate with threaded studs for heatsink attach. A clearance hole is located at the center of the heatsink backplate to accommodate the ILM back plate. An insulator is pre-applied.

Note: Heatsink back plate herein is only applicable to 1U server. Desktop has a specific heatsink back plate for its form factor.

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