LGA1155 Socket

3LGA1155 Socket

This chapter describes a surface mount, LGA (Land Grid Array) socket intended for the processors. The socket provides I/O, power and ground contacts. The socket contains 1155 contacts arrayed about a cavity in the center of the socket with lead-free solder balls for surface mounting on the motherboard.

The contacts are arranged in two opposing L-shaped patterns within the grid array. The grid array is 40 x 40 with 24 x 16 grid depopulation in the center of the array and selective depopulation elsewhere.

The socket must be compatible with the package (processor) and the Independent Loading Mechanism (ILM). The ILM design includes a back plate which is integral to having a uniform load on the socket solder joints. Socket loading specifications are listed in Chapter 5.

Figure 3-1. LGA1155 Socket with Pick and Place Cover

Thermal/Mechanical Specifications and Design Guidelines

19