LGA1155 Socket
3LGA1155 Socket
This chapter describes a surface mount, LGA (Land Grid Array) socket intended for the processors. The socket provides I/O, power and ground contacts. The socket contains 1155 contacts arrayed about a cavity in the center of the socket with
The contacts are arranged in two opposing
The socket must be compatible with the package (processor) and the Independent Loading Mechanism (ILM). The ILM design includes a back plate which is integral to having a uniform load on the socket solder joints. Socket loading specifications are listed in Chapter 5.
Figure
Thermal/Mechanical Specifications and Design Guidelines | 19 |