LGA1155 Socket

Figure 3-2. LGA1155 Socket Contact Numbering (Top View of Socket)

30

28 29

26 27

394038

3736

3533 34

313230

2928

27

25 26

23

24

24

25

22

22 23

20 21

18 19

21 20

19 18

17 16

16

17

15

14

14 15

12 13

10 11

13

12

11

 

8

6

4

9

7

5

2 3

1

A

C

E G

J

L

N

R

U

W AA AC AE AG AJ AL AN AR AU AW

B

D

F

H K

M

P

T

V

Y AB AD AF AH AK AM AP AT AV AY

3.1Board Layout

The land pattern for the LGA1155 socket is 36 mils X 36 mils (X by Y) within each of the two L-shaped sections. Note that there is no round-off (conversion) error between socket pitch (0.9144 mm) and board pitch (36 mil) as these values are equivalent. The two L-sections are offset by 0.9144 mm (36 mil) in the x direction and 3.114 mm (122.6 mil) in the y direction, see Figure 3-3. This was to achieve a common package land to PCB land offset which ensures a single PCB layout for socket designs from the multiple vendors.

20

Thermal/Mechanical Specifications and Design Guidelines