LGA1155 Socket and ILM Electrical, Mechanical and Environmental Specifications
5.3Loading Specifications
The socket will be tested against the conditions listed in Chapter 11 with heatsink and the ILM attached, under the loading conditions outlined in this section.
Table
Table
Parameter | Min | Max | Notes |
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ILM static compressive load on processor IHS | 311 N [70 lbf] | 600 N [135 lbf] | |
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Heatsink static compressive load | 0 N [0 lbf] | 222 N [50 lbf] | |
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Total static compressive Load | 311 N [70 lbf] | 822 N [185 lbf] | |
(ILM plus Heatsink) |
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Dynamic Compressive Load | N/A | 712 N [160 lbf] | |
(with heatsink installed) |
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Pick & Place cover insertion force | N/A | 10.2 N [2.3 lbf] | - |
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Pick & Place cover removal force | 2.2N [0.5 lbf] | 7.56 N [1.7 lbf] | |
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Load lever actuation force | N/A | 20.9 N [4.7 lbf] in the | - |
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| vertical direction |
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| 10.2 N [2.3 lbf] in the |
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| lateral direction. |
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Maximum heatsink mass | N/A | 500g | 10 |
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Notes:
1.These specifications apply to uniform compressive loading in a direction perpendicular to the IHS top surface.
2.This is the minimum and maximum static force that can be applied by the heatsink and it’s retention solution to maintain the heatsink to IHS interface. This does not imply the Intel reference TIM is validated to these limits.
3.Loading limits are for the LGA1155 socket.
4.This minimum limit defines the static compressive force required to electrically seat the processor onto the socket contacts. The minimum load is a beginning of life load.
5.Dynamic loading is defined as a load a 4.3 m/s [170 in/s] minimum velocity change average load superimposed on the static load requirement.
6.Test condition used a heatsink mass of 500 gm [1.102 lb.] with 50 g acceleration (table input) and an assumed 2X Dynamic Acceleration Factor (DAF). The dynamic portion of this specification in the product application can have flexibility in specific values. The ultimate product of mass times acceleration plus static heatsink load should not exceed this limit.
7.The maximum BOL value and must not be exceeded at any point in the product life.
8.The minimum value is a beginning of life loading requirement based on load degradation over time.
9.The maximum removal force is the flick up removal upwards thumb force (measured at 45o), not applicable to SMT operation for system assembly. Only the minimum removal force is applicable to vertical removal in SMT operation for system assembly.
10.The maximum heatsink mass includes the heatsink, screws, springs, rings and cups. This mass limit is evaluated using the heatsink attach to the PCB.
5.4Electrical Requirements
LGA1155 socket electrical requirements are measured from the
38 | Thermal/Mechanical Specifications and Design Guidelines |