LGA1155 Socket and ILM Electrical, Mechanical and Environmental Specifications

5.3Loading Specifications

The socket will be tested against the conditions listed in Chapter 11 with heatsink and the ILM attached, under the loading conditions outlined in this section.

Table 5-3provides load specifications for the LGA1155 socket with the ILM installed. The maximum limits should not be exceeded during heatsink assembly, shipping conditions, or standard use condition. Exceeding these limits during test may result in component failure. The socket body should not be used as a mechanical reference or load-bearing surface for thermal solutions.

Table 5-3. Socket & ILM Mechanical Specifications

Parameter

Min

Max

Notes

 

 

 

 

ILM static compressive load on processor IHS

311 N [70 lbf]

600 N [135 lbf]

3, 4, 7, 8

 

 

 

 

Heatsink static compressive load

0 N [0 lbf]

222 N [50 lbf]

1, 2, 3

 

 

 

 

Total static compressive Load

311 N [70 lbf]

822 N [185 lbf]

3, 4, 7, 8

(ILM plus Heatsink)

 

 

 

 

 

 

 

Dynamic Compressive Load

N/A

712 N [160 lbf]

1, 3, 5, 6

(with heatsink installed)

 

 

 

 

 

 

 

Pick & Place cover insertion force

N/A

10.2 N [2.3 lbf]

-

 

 

 

 

Pick & Place cover removal force

2.2N [0.5 lbf]

7.56 N [1.7 lbf]

9

 

 

 

 

Load lever actuation force

N/A

20.9 N [4.7 lbf] in the

-

 

 

vertical direction

 

 

 

10.2 N [2.3 lbf] in the

 

 

 

lateral direction.

 

 

 

 

 

Maximum heatsink mass

N/A

500g

10

 

 

 

 

Notes:

1.These specifications apply to uniform compressive loading in a direction perpendicular to the IHS top surface.

2.This is the minimum and maximum static force that can be applied by the heatsink and it’s retention solution to maintain the heatsink to IHS interface. This does not imply the Intel reference TIM is validated to these limits.

3.Loading limits are for the LGA1155 socket.

4.This minimum limit defines the static compressive force required to electrically seat the processor onto the socket contacts. The minimum load is a beginning of life load.

5.Dynamic loading is defined as a load a 4.3 m/s [170 in/s] minimum velocity change average load superimposed on the static load requirement.

6.Test condition used a heatsink mass of 500 gm [1.102 lb.] with 50 g acceleration (table input) and an assumed 2X Dynamic Acceleration Factor (DAF). The dynamic portion of this specification in the product application can have flexibility in specific values. The ultimate product of mass times acceleration plus static heatsink load should not exceed this limit.

7.The maximum BOL value and must not be exceeded at any point in the product life.

8.The minimum value is a beginning of life loading requirement based on load degradation over time.

9.The maximum removal force is the flick up removal upwards thumb force (measured at 45o), not applicable to SMT operation for system assembly. Only the minimum removal force is applicable to vertical removal in SMT operation for system assembly.

10.The maximum heatsink mass includes the heatsink, screws, springs, rings and cups. This mass limit is evaluated using the heatsink attach to the PCB.

5.4Electrical Requirements

LGA1155 socket electrical requirements are measured from the socket-seating plane of the processor to the component side of the socket PCB to which it is attached. All specifications are maximum values (unless otherwise stated) for a single socket contact, but includes effects of adjacent contacts where indicated.

38

Thermal/Mechanical Specifications and Design Guidelines