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DBS1200V3RPS manual
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124 pages, 3.69 Mb
Thermal Specifications
62
Thermal/Mechanical Specifications and Design Guidelines
Contents
Intel® Xeon ® Processor E3-1200Product Family and LGA 1155 Socket
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Contents
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Figures
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Tables
Revision History
1Introduction
1.1References
1.2Definition of Terms
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2Package Mechanical & Storage Specifications
2.1Package Mechanical Specifications
2.1.1Package Mechanical Drawing
2.1.2Processor Component Keep-OutZones
2.1.3Package Loading Specifications
2.1.4Package Handling Guidelines
2.1.5Package Insertion Specifications
2.1.6Processor Mass Specification
2.1.7Processor Materials
2.1.8Processor Markings
2.1.9Processor Land Coordinates
2.2Processor Storage Specifications
3LGA1155 Socket
3.1Board Layout
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3.2Attachment to Motherboard
3.3Socket Components
3.4Package Installation / Removal
3.5Durability
3.6Markings
3.7Component Insertion Forces
3.8Socket Size
4Independent Loading Mechanism (ILM)
4.1Design Concept
4.1.2ILM Back Plate Design Overview
4.1.3Shoulder Screw and Fasteners Design Overview
4.2Assembly of ILM to a Motherboard
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4.3ILM Interchangeability
4.4Markings
4.5ILM Cover
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5LGA1155 Socket and ILM Electrical, Mechanical and Environmental Specifications
Component Mass
5.2 Package/Socket Stackup Height
5.3Loading Specifications
5.4Electrical Requirements
5.5Environmental Requirements
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6Thermal Specifications
6.1Thermal Specifications
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6.1.1Intel® Xeon® Processor E3-1280(95W)Thermal Profile
6.1.2Intel® Xeon® Processor E3-1200(80W) Thermal Profile
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6.1.3Intel® Xeon® Processor E3-1260L(45W) Thermal Profile
6.1.4Intel® Xeon® Processor E3-1220L(20W) Thermal Profile
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Processor Specification for Operation Where Digital Thermal Sensor Exceeds T
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6.2Processor Thermal Features
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6.3Intel® Turbo Boost Technology
6.4Thermal Considerations
6.4.1Intel® Turbo Boost Technology Power Control and Reporting
6.4.2Package Power Control
6.4.3Power Plane Control
6.4.4Turbo Time Parameter
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7PECI Interface
7.1Platform Environment Control Interface (PECI)
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8Sensor Based Thermal Specification Design Guidance
8.1Sensor Based Specification Overview (DTS 1.0)
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8.2Sensor Based Thermal Specification
8.3Thermal Solution Design Process
8.4Fan Speed Control (FSC) Design Process
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8.4.1DTS 1.1 A New Fan Speed Control Algorithm without
Data
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8.5System Validation
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91U Thermal Solution
9.1Performance Targets
9.21U Collaboration Heatsink
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9.2.2Thermal Solution
9.2.3Assembly
9.31U Reference Heatsink
9.4Geometric Envelope for 1U Thermal Mechanical Design
9.5Thermal Interface Material
9.6Heat Pipe Thermal Consideration
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10Active Tower Thermal Solution
10.1Introduction
10.2Mechanical Specifications
10.3Electrical Requirements
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10.4Cooling Requirements
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11Thermal Solution Quality and Reliability Requirements
11.1Reference Heatsink Thermal Verification
11.2Mechanical Environmental Testing
11.2.1Recommended Test Sequence
11.2.2Post-TestPass Criteria
11.2.3Recommended BIOS/Processor/Memory Test Procedures
11.3Material and Recycling Requirements
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A Component Suppliers
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B Mechanical Drawings
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C Socket Mechanical Drawings
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DPackage Mechanical Drawings
