Package Mechanical & Storage Specifications

2.1.1Package Mechanical Drawing

Figure 2-2shows the basic package layout and dimensions. The detailed package mechanical drawings are in Appendix D. The drawings include dimensions necessary to design a thermal solution for the processor. These dimensions include:

1.Package reference with tolerances (total height, length, width, and so on)

2.IHS parallelism and tilt

3.Land dimensions

4.Top-side and back-side component keep-out dimensions

5.Reference datums

6.All drawing dimensions are in mm.

Figure 2-2. Package View

37.5

37.5

2.1.2Processor Component Keep-Out Zones

The processor may contain components on the substrate that define component keep- out zone requirements. A thermal and mechanical solution design must not intrude into the required keep-out zones. Decoupling capacitors are typically mounted to either the topside or land-side of the package substrate. See Figure B-3and Figure B-4for keep- out zones. The location and quantity of package capacitors may change due to manufacturing efficiencies but will remain within the component keep-in. This keep-in zone includes solder paste and is a post reflow maximum height for the components.

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Thermal/Mechanical Specifications and Design Guidelines