Package Mechanical & Storage Specifications
2.1.1Package Mechanical DrawingFigure 2-2shows the basic package layout and dimensions. The detailed package mechanical drawings are in Appendix D. The drawings include dimensions necessary to design a thermal solution for the processor. These dimensions include:
1.Package reference with tolerances (total height, length, width, and so on)
2.IHS parallelism and tilt
3.Land dimensions
4.Top-side and back-side component keep-out dimensions
5.Reference datums
6.All drawing dimensions are in mm.
Figure 2-2. Package View
37.5
37.5
2.1.2Processor Component Keep-Out ZonesThe processor may contain components on the substrate that define component keep- out zone requirements. A thermal and mechanical solution design must not intrude into the required keep-out zones. Decoupling capacitors are typically mounted to either the topside or land-side of the package substrate. See Figure B-3and Figure B-4for keep- out zones. The location and quantity of package capacitors may change due to manufacturing efficiencies but will remain within the component keep-in. This keep-in zone includes solder paste and is a post reflow maximum height for the components.
14 | Thermal/Mechanical Specifications and Design Guidelines |