Active Tower Thermal Solution

10.2Mechanical Specifications

10.2.1Cooling Solution Dimensions

This section documents the mechanical specifications. Figure 10-1shows a mechanical representation of the solution.

Clearance is required around the fan heatsink to ensure unimpeded airflow for proper cooling. The physical space requirements and dimensions for the processor with assembled thermal solution are shown in Figure 10-2(Side View), and Figure 10-3(Top View). The airspace requirements for this active tower heatsink must also be incorporated into new baseboard and system designs. Note that some figures have centerlines shown (marked with alphabetic designations) to clarify relative dimensioning.

Figure 10-2. Physical Space Requirements for the Solution (side view)

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Thermal/Mechanical Specifications and Design Guidelines