Component Suppliers
Table
Item | Intel PN | Foxconn | Molex | Tyco | Lotes |
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LGA115x ILM | 475973003 | ||||
cover only |
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| P01 | |
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LGA115x ILM Back | 475969930 | ||||
Plate (with |
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| Y09 |
screws) |
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1U ILM Back Plate | N/A | N/A | |||
(with Screws) |
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| Y03 |
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Table
Supplier | Contact |
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AVC | Kai Chang | +86 | 755 3366 8888 | kai_chang@avc.com.tw | |
(Asia Vital |
| x63588 |
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Components Co., |
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Ltd.) |
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Delta | William Bradshaw | +1 | 510 | ||
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| +86 | 136 8623 1080 |
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Foxconn | Julia Jiang | +1 | 408 919 6178 | juliaj@foxconn.com | |
| (for socket and ILM) | +1 | 512 670 2638 | ray.wang@foxconn.com | |
| Ray Wang |
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| (for heatsink) |
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ITW Fastex | Chak Chakir | +1 | 512 989 7771 | Chak.chakir@itweba.com | |
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Lotes Co., Ltd. | Windy Wong | +1 | 604 721 1259 | windy@lotestech.com | |
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Molex | Carol Liang | +86 | 21 504 80889 x3301 | carol.liang@molex.com | |
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Nidec | Karl Mattson | +1 | 360 666 2445 | karl.mattson@nidec.com | |
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Tyco | Billy Hsieh | +81 | 44 844 8292 | billy.hsieh@tycoelectronics.com | |
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The enabled components may not be currently available from all suppliers. Contact the supplier directly to verify time of component availability.
§
94 | Thermal/Mechanical Specifications and Design Guidelines |