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Intel DBS1200V3RPS manual 110

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Mechanical Drawings

Figure B-15. Heatsink Backplate Insulator

110	Thermal/Mechanical Specifications and Design Guidelines

Contents

Intel® Xeon ® Processor E3-1200Product Family and LGA 1155 Socket Page Contents Page Figures Page Tables Revision History 1Introduction 1.1References 1.2Definition of Terms Page Page 2Package Mechanical & Storage Specifications 2.1Package Mechanical Specifications 2.1.1Package Mechanical Drawing 2.1.2Processor Component Keep-OutZones 2.1.3Package Loading Specifications 2.1.4Package Handling Guidelines 2.1.5Package Insertion Specifications 2.1.6Processor Mass Specification 2.1.7Processor Materials 2.1.8Processor Markings 2.1.9Processor Land Coordinates 2.2Processor Storage Specifications 3LGA1155 Socket 3.1Board Layout Page 3.2Attachment to Motherboard 3.3Socket Components 3.4Package Installation / Removal 3.5Durability 3.6Markings 3.7Component Insertion Forces 3.8Socket Size 4Independent Loading Mechanism (ILM) 4.1Design Concept 4.1.2ILM Back Plate Design Overview 4.1.3Shoulder Screw and Fasteners Design Overview 4.2Assembly of ILM to a Motherboard Page 4.3ILM Interchangeability 4.4Markings 4.5ILM Cover Page Page Page 5LGA1155 Socket and ILM Electrical, Mechanical and Environmental Specifications Component Mass 5.2 Package/Socket Stackup Height 5.3Loading Specifications 5.4Electrical Requirements 5.5Environmental Requirements Page 6Thermal Specifications 6.1Thermal Specifications Page 6.1.1Intel® Xeon® Processor E3-1280(95W)Thermal Profile 6.1.2Intel® Xeon® Processor E3-1200(80W) Thermal Profile Page 6.1.3Intel® Xeon® Processor E3-1260L(45W) Thermal Profile 6.1.4Intel® Xeon® Processor E3-1220L(20W) Thermal Profile Page Processor Specification for Operation Where Digital Thermal Sensor Exceeds T Page Page Page Page 6.2Processor Thermal Features Page Page Page 6.3Intel® Turbo Boost Technology 6.4Thermal Considerations 6.4.1Intel® Turbo Boost Technology Power Control and Reporting 6.4.2Package Power Control 6.4.3Power Plane Control 6.4.4Turbo Time Parameter Page 7PECI Interface 7.1Platform Environment Control Interface (PECI) Page 8Sensor Based Thermal Specification Design Guidance 8.1Sensor Based Specification Overview (DTS 1.0) Page 8.2Sensor Based Thermal Specification 8.3Thermal Solution Design Process 8.4Fan Speed Control (FSC) Design Process Page 8.4.1DTS 1.1 A New Fan Speed Control Algorithm without Data Page 8.5System Validation Page 91U Thermal Solution 9.1Performance Targets 9.21U Collaboration Heatsink Page Page 9.2.2Thermal Solution 9.2.3Assembly 9.31U Reference Heatsink 9.4Geometric Envelope for 1U Thermal Mechanical Design 9.5Thermal Interface Material 9.6Heat Pipe Thermal Consideration Page 10Active Tower Thermal Solution 10.1Introduction 10.2Mechanical Specifications 10.3Electrical Requirements Page 10.4Cooling Requirements Page 11Thermal Solution Quality and Reliability Requirements 11.1Reference Heatsink Thermal Verification 11.2Mechanical Environmental Testing 11.2.1Recommended Test Sequence 11.2.2Post-TestPass Criteria 11.2.3Recommended BIOS/Processor/Memory Test Procedures 11.3Material and Recycling Requirements Page A Component Suppliers Page B Mechanical Drawings Page Page Page Page Page Page Page Page Page Page Page Page Page Page Page Page Page Page Page C Socket Mechanical Drawings Page Page Page Page Page DPackage Mechanical Drawings

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