Independent Loading Mechanism (ILM)

4.5ILM Cover

Intel has developed an ILM Cover that will snap onto the ILM for the LGA115x socket family. The ILM cover is intended to reduce the potential for socket contact damage from operator and customer fingers being close to the socket contacts to remove or install the pick and place cap. The ILM Cover concept is shown in Figure 4-6.

The ILM Cover is intended to be used in place of the pick and place cover once the ILM is assembled to the motherboard. The ILM will be offered with the ILM Cover pre assembled as well as offered as a discrete component.

ILM Cover features:

•Pre-assembled by the ILM vendors to the ILM load plate. It will also be offered as a discrete component.

•The ILM cover will pop off if a processor is installed in the socket, and the ILM Cover and ILM are from the same manufacturer.

•ILM Cover can be installed while the ILM is open.

•Maintain compatibility between validated ILM vendors for LGA115x socket, with the exception noted below1.

•The ILM cover for the LGA115x socket will have a flammability rating of V-2 per UL 60950-1.

Note: The ILM Cover pop off feature is not supported if the ILM Covers are interchanged on different vendor’s ILMs.

Thermal/Mechanical Specifications and Design Guidelines

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