Intel DBS1200V3RPS 91U Thermal Solution, 9.1Performance Targets, 9.21U Collaboration Heatsink, 9.2.1Heatsink Performance

1U Thermal Solution

91U Thermal Solution

Note: The thermal mechanical solution information shown in this document represents the current state of the data and may be subject to modification.The information represents design targets, not commitments by Intel.

This section describes the overall requirements for enabled thermal solutions designed to cool the Intel® Xeon® Processor E3-1200 product family including critical to function dimensions, operating environment and validation criteria in 1U server system. Intel has developed two different collaboration/reference 1U thermal solutions to meet the cooling needs in this document.

9.1Performance Targets

Table 9-1provides boundary conditions and performance targets for a 1U heatsink to cool processor in 1U server. These values are used to provide guidance for heatsink design.

Table 9-1. Boundary Conditions and Performance Targets

		Thermal			Air Flow3	Pressure
Processor	Altitude	Design	TLA	Ψca2
						Drop4
		Power
Intel® Xeon®	Sea Level	95W	40.0°C	0.353°C/W	15CFM	0.383
processor E3-
1280 (95W)
Intel® Xeon®	Sea Level	80W	40.8°C	0.353°C/W	15CFM	0.383
processor E3-
1200 (80W)
Intel® Xeon®	Sea Level	45W	42.7°C	0.353°C/W	15CFM	0.383
processor E3-
1260L (45W)
Intel® Xeon®	Sea Level	20W	67.0°C	0.527°C/W	10CFM	0.123
processor E3-
1220L (20W)

Notes:

1.The values in Table 9-1are from preliminary design review.

2.Max target (mean + 3 sigma) for thermal characterization parameter.

3.Airflow through the heatsink fins with zero bypass.

4.Max target for pressure drop (dP) measured in inches H2O.

9.21U Collaboration Heatsink

9.2.1Heatsink Performance

For 1U collaboration heatsink, see Appendix B for detailed drawings. Figure 9-1shows ΨCAand pressure drop for the 1U collaboration heatsink versus the airflow provided. Best-fit equations are provided to prevent errors associated with reading the graph.

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