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Active Tower Thermal Solution
10Active Tower Thermal Solution
10.1Introduction
This active tower thermal solution is intended for system integrators who build systems from baseboards and standard components. This chapter documents baseboard and system requirements for the cooling solution. It is particularly important for OEMs that manufacture baseboards for system integrators.
Note: Unless otherwise noted, all figures in this chapter are dimensioned in millimeters and inches [in brackets]. Figure
Note: Drawings in this chapter reflect only the specifications on this active tower thermal solution. These dimensions should not be used as a generic
Figure
Thermal/Mechanical Specifications and Design Guidelines | 83 |