Active Tower Thermal Solution

10Active Tower Thermal Solution

10.1Introduction

This active tower thermal solution is intended for system integrators who build systems from baseboards and standard components. This chapter documents baseboard and system requirements for the cooling solution. It is particularly important for OEMs that manufacture baseboards for system integrators.

Note: Unless otherwise noted, all figures in this chapter are dimensioned in millimeters and inches [in brackets]. Figure 10-1shows a mechanical representation of the active tower thermal solution.

Note: Drawings in this chapter reflect only the specifications on this active tower thermal solution. These dimensions should not be used as a generic keep-out zone for all cooling solutions. It is the system designers’ responsibility to consider their proprietary cooling solution when designing to the required keep-out zone on their system platforms and chassis. Refer to the desktop processor thermal mechanical design guide for further guidance on keep in and keep out zones.

Figure 10-1. Mechanical Representation of the Solution

Thermal/Mechanical Specifications and Design Guidelines

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