Intel DBS1200V3RPS 5.5Environmental Requirements

LGA1155 Socket and ILM Electrical, Mechanical and Environmental Specifications

Table 5-4.	Electrical Requirements for LGA1155 Socket
	Parameter	Value	Comment
			The inductance calculated for two contacts,
	Mated loop inductance, Loop	<3.6 nH	considering one forward conductor and one
			return conductor. These values must be satisfied
			at the worst-case height of the socket.
			The socket average contact resistance target is
			calculated from the following equation:
			sum (Ni X LLCRi) / sum (Ni)
			• LLCRi is the chain resistance defined as the
			resistance of each chain minus resistance of
	Socket Average Contact Resistance	19 mOhm	shorting bars divided by number of lands in
	(EOL)		the daisy chain.
			• Ni is the number of contacts within a chain.
			• I is the number of daisy chain, ranging from
			1 to 119 (total number of daisy chains).
			The specification listed is at room temperature
			and has to be satisfied at all time.
			The specification listed is at room temperature
	Max Individual Contact Resistance	100 mOhm	and has to be satisfied at all time.
			Socket Contact Resistance: The resistance of
	(EOL)
			the socket contact, solderball, and interface
			resistance to the interposer land; gaps included.
	Bulk Resistance Increase	≤ 3 mΩ	The bulk resistance increase per contact from
			25°C to 100°C.
	Dielectric Withstand Voltage	360 Volts RMS
	Insulation Resistance	800 MΩ

5.5Environmental Requirements

Design, including materials, shall be consistent with the manufacture of units that meet the following environmental reference points.

The reliability targets in this section are based on the expected field use environment for these products. The test sequence for new sockets will be developed using the knowledge-based reliability evaluation methodology, which is acceleration factor dependent. A simplified process flow of this methodology can be seen in Figure 5-1.

Thermal/Mechanical Specifications and Design Guidelines 39