1U Thermal Solution

9.31U Reference Heatsink

9.3.1Heatsink Performance

For 1U reference heatsink, see Appendix B for detailed drawings. Figure 9-4shows

ΨCAand pressure drop for the 1U reference heatsink versus the airflow provided. Best- fit equations are provided to prevent errors associated with reading the graph.

Figure 9-4. 1U Reference Heatsink Performance Curves

This 1U Reference thermal solution Ψca(mean+3sigma) is computed to 0.353°C/W at the airflow of 15.5 CFM, which just meets Intel® Xeon® processor E3-1280 (95W) TTV thermal profile specification when TLA is 40 °C.

9.3.2Thermal Solution

The reference thermal solution consists of two assemblies: heatsink assembly & back plate.

Heatsink is designed with extruded Aluminum, which volumetrically is 95x95x24.85 mm with total 43 fins. Please refer to Appendix B for detailed drawings.

Heatsink back plate is a 1.8 mm thick flat steel plate with threaded studs for heatsink attach. A clearance hole is located at the center of the heatsink backplate to accommodate the ILM back plate. An insulator is pre-applied.

Note: Heatsink back plate herein is only applicable to 1U server. Desktop has a specific heatsink back plate for its form factor.

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