Active Tower Thermal Solution
10.4Cooling Requirements
The processor may be directly cooled with a fan heatsink. However, meeting the processor's temperature specification is also a function of the thermal design of the entire system, and ultimately the responsibility of the system integrator. The processor temperature specification is found in Chapter 6 of this document. The active tower heatsink is able to keep the processor temperature within the specifications (see Table 6-1) in chassis that provide good thermal management. For fan heatsink to operate properly, it is critical that the airflow provided to the heatsink is unimpeded. Airflow of the fan heatsink is into the front of fan and straight out of the heatsink rear side. Airspace is required around the fan to ensure that the airflow through the fan heatsink is not blocked. Blocking the airflow to the fan heatsink reduces the cooling efficiency and decreases fan life. Figure 10-6illustrate an acceptable front airspace clearance for the fan heatsink which is recommended to at least 15 mm or larger. The air temperature entering the fan should be kept below 40 ºC. Again, meeting the processor's temperature specification is the responsibility of the system integrator.
Figure 10-6. Active Tower Heatsink Airspace Keepout Requirements (side view)
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Thermal/Mechanical Specifications and Design Guidelines | 87 |
