LGA1155 Socket and ILM Electrical, Mechanical and Environmental Specifications

5LGA1155 Socket and ILM Electrical, Mechanical and Environmental Specifications

This chapter describes the electrical, mechanical and environmental specifications for the LGA1155 socket and the Independent Loading Mechanism.

5.1

Component Mass

 

Table 5-1. Socket Component Mass

 

 

 

 

 

Component

Mass

 

 

 

 

Socket Body, Contacts and PnP Cover

10 g

 

 

 

 

ILM Cover

29 g

 

 

 

 

ILM Back Plate

38 g

 

 

 

5.2 Package/Socket Stackup Height

Table 5-2provides the stackup height of a processor in the 1155-land LGA package and LGA1155 socket with the ILM closed and the processor fully seated in the socket.

Table 5-2. 1155-land Package and LGA1155 Socket Stackup Height

Component

Stackup Height

Note

 

 

 

Integrated Stackup Height (mm)

7.781 ± 0.335 mm

2

From Top of Board to Top of IHS

 

 

 

 

 

Socket Nominal Seating Plane Height

3.4 ± 0.2 mm

1

 

 

 

Package Nominal Thickness (lands to top of IHS)

4.381 ± 0.269 mm

1

 

 

 

Notes:

1.This data is provided for information only, and should be derived from: (a) the height of the socket seating plane above the motherboard after reflow, given in Appendix C, (b) the height of the package, from the package seating plane to the top of the IHS, and accounting for its nominal variation and tolerances that are given in the corresponding processor data sheet.

2.The integrated stackup height value is a RSS calculation based on current and planned processors that will use the ILM design.

Thermal/Mechanical Specifications and Design Guidelines

37