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LGA1155 Socket and ILM Electrical, Mechanical and Environmental Specifications
5LGA1155 Socket and ILM Electrical, Mechanical and Environmental Specifications
This chapter describes the electrical, mechanical and environmental specifications for the LGA1155 socket and the Independent Loading Mechanism.
5.1 | Component Mass |
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| Component | Mass |
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| Socket Body, Contacts and PnP Cover | 10 g |
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| ILM Cover | 29 g |
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| ILM Back Plate | 38 g |
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5.2 Package/Socket Stackup Height
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Component | Stackup Height | Note |
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Integrated Stackup Height (mm) | 7.781 ± 0.335 mm | |
From Top of Board to Top of IHS |
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Socket Nominal Seating Plane Height | 3.4 ± 0.2 mm | |
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Package Nominal Thickness (lands to top of IHS) | 4.381 ± 0.269 mm | |
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Notes:
1.This data is provided for information only, and should be derived from: (a) the height of the socket seating plane above the motherboard after reflow, given in Appendix C, (b) the height of the package, from the package seating plane to the top of the IHS, and accounting for its nominal variation and tolerances that are given in the corresponding processor data sheet.
2.The integrated stackup height value is a RSS calculation based on current and planned processors that will use the ILM design.
Thermal/Mechanical Specifications and Design Guidelines | 37 |