Guidelines Design and Specifications Thermal/Mechanical
TOP SIDE
PCB ILM MOUNTING HOLES
18.00 | 0.00 | 18.00 |
25.81
0.00
PIN 1 
40.71
35.21
C | R3.50 |
3X 
6.00
NO ROUTE ON
PRIMARY & SECONDARY SIDES 3 X 
4.70 NO ROUTE ON ALL OTHER LAYERS
COPPER PAD ON PRIMARY SIDE,
COPPER PAD CAN INSET MAXIMUM
OF .127MM FROM THE NO ROUTE EDGE
0.1 | B C |
|
|
| 25.70 |
3X 3.80 | +0.05 | NPTH |
( 10.50 | ) | B |
| ||
|
| B |
5 FINGER ACCESS
COMPONENT KEEPOUT
AREA
TOP SIDE
PCB ILM SILKSCREEN
ADD SILKSCREEN OUTLINE
ON PCB PRIMARY SIDE
AS SHOWN
0.00 | 25.70 |
LEVER UNLATCHED
( 18.12 )
17.00
10.97
( 6.30 )
3.50
8.00
3.50
( 11.78 ) 
( 13.75 )
( 15.83 )
DETAIL A
37.31
23.81
0.00
TOP SIDE VIEW
Drawings Mechanical | ||
(Bottom)1U for Side Secondary Zone Keepout ILM / Processor / |
|
|
|
| |
|
| |
99
25.50
( 47.50 ) | C |
SIZE | DRAWING NUMBER |
| REV | |
A1 |
| E21320 |
| J |
SCALE: NONE | DO NOT SCALE DRAWING | SHEET 2 OF 2 | ||