Intel DBS1200V3RPS manual 4

		6.1.4	Intel® Xeon® Processor E3-1220L (20W) Thermal Profile..............................	47
		6.1.5	Intel® Xeon® Processor E3-1200 (95W) with Integrated
			Graphics Thermal Profile..........................................................................	48
		6.1.6	Processor Specification for Operation Where Digital Thermal
			Sensor Exceeds TCONTROL ......................................................................	49
		6.1.7	Thermal Metrology..................................................................................	54
	6.2	Processor Thermal Features ................................................................................		54
		6.2.1	Processor Temperature............................................................................	54
		6.2.2	Adaptive Thermal Monitor ........................................................................	54
		6.2.3	THERMTRIP# Signal ................................................................................	58
	6.3	Intel® Turbo Boost Technology ............................................................................		58
		6.3.1	Intel® Turbo Boost Technology Frequency..................................................	58
		6.3.2	Intel® Turbo Boost Technology Graphics Frequency.....................................	59
	6.4	Thermal Considerations ......................................................................................		59
		6.4.1	Intel® Turbo Boost Technology Power Control and Reporting ........................	60
		6.4.2	Package Power Control ............................................................................	61
		6.4.3	Power Plane Control ................................................................................	61
		6.4.4	Turbo Time Parameter.............................................................................	61
7	PECI Interface .........................................................................................................			63
	7.1	Platform Environment Control Interface (PECI) ......................................................		63
		7.1.1	Introduction...........................................................................................	63
8	Sensor Based Thermal Specification Design Guidance ..............................................			65
	8.1	Sensor Based Specification Overview (DTS 1.0) .....................................................		65
	8.2	Sensor Based Thermal Specification .....................................................................		67
		8.2.1	TTV Thermal Profile.................................................................................	67
		8.2.2	Specification When DTS value is Greater than TCONTROL.............................	68
	8.3	Thermal Solution Design Process .........................................................................		68
		8.3.1	Boundary Condition Definition ..................................................................	68
		8.3.2	Thermal Design and Modelling ..................................................................	69
		8.3.3	Thermal Solution Validation......................................................................	69
	8.4	Fan Speed Control (FSC) Design Process...............................................................		69
		8.4.1	DTS 1.1 A New Fan Speed Control Algorithm without TAMBIENT Data ............	71
	8.5	System Validation..............................................................................................		73
9	1U Thermal Solution ................................................................................................			75
	9.1	Performance Targets ..........................................................................................		75
	9.2	1U Collaboration Heatsink ...................................................................................		75
		9.2.1	Heatsink Performance .............................................................................	75
		9.2.2	Thermal Solution ....................................................................................	78
		9.2.3	Assembly...............................................................................................	79
	9.3	1U Reference Heatsink .......................................................................................		80
		9.3.1	Heatsink Performance .............................................................................	80
		9.3.2	Thermal Solution ....................................................................................	80
		9.3.3	Assembly...............................................................................................	81
	9.4	Geometric Envelope for 1U Thermal Mechanical Design ...........................................		81
	9.5	Thermal Interface Material ..................................................................................		81
	9.6	Heat Pipe Thermal Consideration .........................................................................		81
10	Active Tower Thermal Solution ................................................................................			83
	10.1	Introduction......................................................................................................		83
	10.2	Mechanical Specifications....................................................................................		84
		10.2.1	Cooling Solution Dimensions ....................................................................	84
		10.2.2	Retention Mechanism and Heatsink Attach Clip Assembly .............................	85
	10.3	Electrical Requirements ......................................................................................		85
		10.3.1	Active Tower Heatsink Power Supply .........................................................	85
	10.4	Cooling Requirements ........................................................................................		87

4 Thermal/Mechanical Specifications and Design Guideline