Hardware Design Guidelines—Intel®IXP43X Product Line of Network Processors

Table 31.

DDR II/I SDRAM Interface -- Signal Timings

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Symbol

 

Parameter

Minimum

Nom.

 

Maximum

Units

Notes

 

 

 

 

 

 

 

 

 

 

 

 

 

TVB1

 

DQ, CB and DM write output valid time

1146

 

 

 

ps

1

 

 

 

before DQS.

 

 

 

 

 

TVA1

 

DQ, CB and DM write output valid time after

1146

 

 

 

ps

1

 

 

 

DQS.

 

 

 

 

 

TVB3

 

Address and Command write output valid

3021

 

 

 

ps

1, 4

 

 

 

before CK rising edge.

 

 

 

 

 

TVA3

 

Address and Command write output valid

3021

 

 

 

ps

1, 4

 

 

 

after CK rising edge.

 

 

 

 

 

TVB4

 

DQ, CB and DM read input valid time before

948

 

 

 

ps

2

 

 

 

DQS rising or falling edges.

 

 

 

 

 

TVA4

 

DQ, CB and DM read input valid time after

948

 

 

 

ps

2

 

 

 

DQS rising or falling edges.

 

 

 

 

 

TVB5

 

CS_N[1:0] control valid before CK rising

3021

 

 

 

ps

4

 

 

 

edge.

 

 

 

 

 

TVA5

 

CS_N[1:0] control valid after CK rising edge.

3021

 

 

 

ps

4

 

 

TVB6

 

DQS write preamble duration.

 

5625

 

 

ps

3

 

 

TVA6

 

DQS write postamble duration.

 

3750

 

 

ps

3

 

 

TV7

 

DQ, CB, and DM pulse width (tDIPW)

 

1750

 

 

ps

1

 

 

Notes:

 

 

 

 

 

 

 

 

 

 

1.

See Figure 29, “DDR SDRAM Write Timings” on page 77

 

 

 

 

 

 

 

2.

See Figure 30, “DDR SDRAM Read Timings” on page 77. The specified minimum requirements for “Data to

 

 

 

strobe read setup” and “Data from strobe read hold” are determined with the DQS delay programmed for

 

 

 

90 degree phase shift.

 

 

 

 

 

 

 

 

3.

See Figure 31, “DDR - Write Preamble/Postamble Duration” on page 78

 

 

 

 

 

4.

Address/Command pin group; RAS_N, CAS_N, WE_N, MA[13:0], BA[1:0]

 

 

 

 

 

5.

Designed to JEDEC specification; it is recommended that IBIS models should be used to verify signal

 

 

 

integrity on individual designs

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

7.3.1.0.1Printed Circuit Board Layer Stackup

The layer stackup used for the Intel® IXP435 Multi-Service Residential Gateway Reference Platform is a 6-layer, printed circuit board with four signal layers and two plane layers.

Details on the voltage reference layout are available in the CAD database or Gerber files database for the Intel® IXP435 Multi-Service Residential Gateway Reference Platform.

7.3.2Timing Relationships

The routing guidelines presented in the following subsections define the recommended routing topologies, trace width, spacing geometries, and typical routed lengths for each signal group. These parameters are recommended to achieve optimal signal integrity and timing.

All signal groups are length matched to the DDR clocks. The clocks on the processor module are length matched to within ±10 mils of each other. Once this overall clock length for any given DDR differential clock is determined, the command and control signals can be routed to within the timing specified. A simple summary of the timing results for each signal group is provided in Table 32 on page 80.

Control/Command Group to Clock Summary:

The maximum allowable difference from any command/control signal to the clock is ±0.6 ns.

 

Intel® IXP43X Product Line of Network Processors

April 2007

HDG

Document Number: 316844; Revision: 001US

79

Page 79
Image 79
Intel IXP43X Timing Relationships, DDR II/I Sdram Interface -- Signal Timings, Printed Circuit Board Layer Stackup, Dqs