Intel® IXP43X Product Line of Network Processors—Hardware Design Guidelines

Table 4.

DDRII/I SDRAM Interface Pin Description (Sheet 2 of 2)

 

 

 

 

 

 

 

 

Type

 

VTT

 

Name

 

Device-Pin Connection

Terminatio

Description

 

Field

 

 

 

n

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

ECC Bus — Eight-bit error correction code

 

 

 

 

 

which accompanies the data on D_DQ[31:0]/

D_CB[7:0] /

 

I/O

Connect to ECC memory devices.

Yes

DDR_DQ[31:0].

DDR_CB[7:0]

 

When ECC is disabled and not being used in a

 

 

 

 

 

 

 

 

 

system design, these signals can be left un-

 

 

 

 

 

connected.

 

 

 

 

 

 

 

 

 

 

 

Data Strobes Differential — Strobes that

 

 

 

 

 

accompany the data to be read or written from

 

 

 

Connect DQS[3:0] to devices with

 

the DDRII/I SDRAM devices. Data is sampled

D_DQS[4:0] /

 

 

 

on the negative and positive edges of these

 

I/O

data signals and DQS[4] to

Yes

DDR_DQS[4:0]

 

strobes. D_DQS[3:0]/DDR_DQS[3:0] are

 

 

devices with ECC signals.

 

 

 

 

 

intended to correspond to each byte of a word

 

 

 

 

 

 

 

 

 

 

of data. D_DQS[4]/DDR_DQS[4] is intended to

 

 

 

 

 

be utilized for the ECC byte of data.

 

 

 

 

 

 

 

 

 

 

 

Clock enables — One clock after D_CKE[1:0]/

 

 

 

 

 

DDR_CKE[1:0] is de-asserted, data is latched

 

 

 

Use one CKE per bank, never mix

 

on D_DQ[31:0]/DDR_DQ[31:0] and

D_CKE[1:0] /

 

 

 

D_CB[7:0]/DDR_CB[7:0]. Burst counters

 

O

the CKE on the same bank. Use

Yes

 

within DDRII/I SDRAM device are not

DDR_CKE[1:0]

 

CKE[0] for bank0 and CKE[1] for

 

 

 

incremented. De-asserting this signal places

 

 

 

bank1

 

 

 

 

 

the DDRII/I SDRAM in self-refresh mode. For

 

 

 

 

 

 

 

 

 

 

normal operation, D_CKE[1:0]/DDR_CKE[1:0]

 

 

 

 

 

must be asserted.

 

 

 

 

 

 

D_ODT[1:0]

 

 

 

 

On Die Termination Control — Turns on DDR II

 

 

 

 

SDRAM termination during writes.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Compensation for DDR OCD (analog) DDRII

D_RES[2:1]

 

 

Refer to Figure 27

 

mode only. This function is not enable and

 

 

 

 

 

special connection is required.

 

 

 

 

 

 

 

 

 

 

 

Compensation Voltage Reference (analog) for

D_SLWCRES

 

 

Refer to Figure 27

 

DDR driver slew rate control connected

 

 

 

 

 

through a resistor to D_CRES0.

 

 

 

 

 

 

 

 

 

 

 

Compensation Voltage Reference (analog) for

D_IMPCRES

 

 

Refer to Figure 27

 

DDR driver impedance control connected

 

 

 

 

 

through a resistor to D_CRES0.

 

 

 

 

 

 

 

 

 

 

 

Analog VSS Ref Pin (analog) both D_SLWCRES

 

 

 

 

 

and D_IMPCRES signals connect to this pin

 

 

 

 

 

through a reference resistor. For DDRII/I

 

 

 

 

 

respectively:

D_CRES0

 

O

Tied off to a resistor

Tied off to a

- 285 / 387Ohm Resistor connected to

 

resistor

DDR_IMPCRES used for process and

 

 

 

 

 

 

 

 

 

temperature adjustments.

 

 

 

 

 

- 825 / 845Ohm Resistor connected to

 

 

 

 

 

DDR_SLWCRES used for process and

 

 

 

 

 

temperature adjustments.

 

 

 

 

 

 

 

 

 

 

 

DDRII/IDDRII/I SDRAM Voltage Reference — is

D_VREF / DDR_VREF

I

VCCDDR/2

VCCDDR/2

used to supply the reference voltage to the

differential inputs of the memory controller

 

 

 

 

 

pins.

 

 

 

 

 

 

3.2.2DDRII/I SDRAM Initialization

For instructions on DDRII/I SDRAM initialization, refer to DDR SDRAM Initialization subsection in the Memory Controller chapter of the Intel® IXP43X Product Line of Network Processors Developer’s Manual.

Intel® IXP43X Product Line of Network Processors

 

HDG

April 2007

20

Document Number: 316844; Revision: 001US

Page 20
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Intel IXP43X manual DDRII/I Sdram Initialization, DDRII/I Sdram Interface Pin Description Sheet 2