Motorola TMS320C6711D manuals
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Motorola TMS320C6711D Warranty
107 pages 1.45 Mb
D D D D D D3.3-V I/O, 1.20-V Internal 3 D D7 D61 Dreset 62 absolute maximum ratings over operating case temperature range (unless otherwise noted)recommended operating conditions 63 64 PARAMETER MEASUREMENT INFORMATION signal transition levels 65 AC transient rise/fall time specifications 66 timing parameters and board routing analysis 68 INPUT AND OUTPUT CLOCKS timing requirements for CLKIN (see Figure 22) timing requirements for CLKIN (see Figure 22) Figure 23. CLKOUT2 Timings Figure 24. CLKOUT3 Timings 69 switching characteristics over recommended operating conditions for CLKOUT3 (see Figure 24)70 INPUT AND OUTPUT CLOCKS (CONTINUED) timing requirements for ECLKIN (see Figure 25)Figure 25. ECLKIN Timings Figure 26. ECLKOUT Timings switching characteristics over recommended operating conditions for ECLKOUT (see Figure 26) 72 ASYNCHRONOUS MEMORY TIMING (CONTINUED)Figure 27. Asynchronous Memory Read Timing 73 ASYNCHRONOUS MEMORY TIMING (CONTINUED)Figure 28. Asynchronous Memory Write Timing 75 SYNCHRONOUS-BURST MEMORY TIMING (CONTINUED)Figure 29. SBSRAM Read Timing Figure 30. SBSRAM Write Timing 76 SYNCHRONOUS DRAM TIMING timing requirements for synchronous DRAM cycles (see Figure 31)77 Figure 31. SDRAM Read Command (CAS Latency 3)78 Figure 32. SDRAM Write Command79 Figure 33. SDRAM ACTV CommandFigure 34. SDRAM DCAB Command 80 Figure 35. SDRAM DEAC CommandFigure 36. SDRAM REFR Command 81 Figure 37. SDRAM MRS Command82 HOLD/HOLDA TIMING timing requirements for the HOLD/HOLDA cycles (see Figure 38)Figure 38. HOLD/HOLDA Timing 83 Figure 39. BUSREQ Timing84 RESET TIMING timing requirements for reset (see Figure 40)switching characteristics over recommended operating conditions during reset (see Figure 40) 85 RESET TIMING (CONTINUED)86 EXTERNAL INTERRUPT TIMING timing requirements for external interrupts (see Figure 41)Figure 41. External/NMI Interrupt Timing 89 Figure 42. HPI Read Timing (HAS Not Used, Tied High)Figure 43. HPI Read Timing (HAS Used) 90 Figure 44. HPI Write Timing (HAS Not Used, Tied High)Figure 45. HPI Write Timing (HAS Used) 91 MULTICHANNEL BUFFERED SERIAL PORT TIMING timing requirements for McBSP (see Figure 46) 92 switching characteristics over recommended operating conditions for McBSP (see Figure 46) 94 timing requirements for FSR when GSYNC = 1 (see Figure 47)Figure 47. FSR Timing When GSYNC = 1 timing requirements for McBSP as SPI master or slave: CLKSTP = 10b, CLKXP = 0 (see Figure 48) 95 slave: CLKSTP = 10b, CLKXP = 0 (see Figure 48) Figure 48. McBSP Timing as SPI Master or Slave: CLKSTP = 10b, CLKXP = 0 96 timing requirements for McBSP as SPI master or slave: CLKSTP = 11b, CLKXP = 0 (see Figure 49)slave: CLKSTP = 11b, CLKXP = 0 (see Figure 49) Figure 49. McBSP Timing as SPI Master or Slave: CLKSTP = 11b, CLKXP = 0 97 timing requirements for McBSP as SPI master or slave: CLKSTP = 10b, CLKXP = 1 (see Figure 50)98 slave: CLKSTP = 10b, CLKXP = 1 (see Figure 50) Figure 50. McBSP Timing as SPI Master or Slave: CLKSTP = 10b, CLKXP = 1 99 timing requirements for McBSP as SPI master or slave: CLKSTP = 11b, CLKXP = 1 (see Figure 51)slave: CLKSTP = 11b, CLKXP = 1 (see Figure 51) Figure 51. McBSP Timing as SPI Master or Slave: CLKSTP = 11b, CLKXP = 1 100 TIMER TIMING timing requirements for timer inputs (see Figure 52)switching characteristics over recommended operating conditions for timer outputs (see Figure 52) 101 switching characteristics over recommended operating conditions for GPIO outputs (see Figure 53)Figure 53. GPIO Port Timing 102 JTAG TEST-PORT TIMING timing requirements for JTAG test port (see Figure 54)switching characteristics over recommended operating conditions for JTAG test port (see Figure 54)Figure 54. JTAG Test-Port Timing 103 MECHANICAL DATA package thermal resistance characteristicsthermal resistance characteristics (S-PBGA package) for GDP thermal resistance characteristics (S-PBGA package) for ZDP packaging information PACKAGING INFORMATION 104 PACKAGE OPTION ADDENDUM105 MECHANICAL DATAGDP (SPBGAN272) PLASTIC BALL GRID ARRAY 106 MECHANICAL DATAZDP (SPBGAN272) PLASTIC BALL GRID ARRAY
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