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Motorola TMS320C6711D warranty Prefix, Device Speed Range, Technology, Package Type †‡§

Models: TMS320C6711D

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SPRS292A − OCTOBER 2005 − REVISED NOVEMBER 2005

device and development-support tool nomenclature (continued)

TMS 320 C 6711D GDP

( ) 250

PREFIX

TMX =

Experimental device

TMP =

Prototype device

DEVICE SPEED RANGE

TMS =

Qualified device

167 MHz

SMJ = MIL-PRF-38535, QML

200 MHz

SM =

High Rel (non-38535)

250 MHz

DEVICE FAMILY

TEMPERATURE RANGE (DEFAULT: 0°C TO 90°C)



32 or 320 = TMS320 DSP family

Blank = 0°C to 90°C, commercial temperature

A

= −40 °C to 105°C, extended temperature

TECHNOLOGY

C = CMOS

PACKAGE TYPE†‡§

GDP = 272-pin plastic BGA

ZDP =

272-pin plastic BGA, with Pb-free soldered balls

DEVICE

C6711D

†BGA = Ball Grid Array

‡The ZDP mechanical package designator represents the version of the GDP with Pb−Free soldered balls. The ZDP package devices are supported in the same speed grades as the GDP package devices (available upon request).

§For actual device part numbers (P/Ns) and ordering information, see the Mechanical Data section of this document or the TI website (www.ti.com).

Figure 5. TMS320C6711D DSP Device Nomenclature

MicroStar BGA and PowerPAD are trademarks of Texas Instruments.

38	POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251−1443

Image 38

Motorola TMS320C6711D warranty Prefix, Device Speed Range, Device Family Temperature Range Default 0 C to 90 C, Technology

Contents

SPRS292A − October 2005 − Revised November Table of Contents Multichannel Buffered Serial Port Timing Revision HistoryPages ADDITIONS/CHANGES/DELETIONS Bottom View GDP and ZDP BGA packages bottom viewGDP and ZDP 272-PIN Ball Grid Array BGA PACKAGES† Description Hardware Features Internal Clock Device characteristicsCharacteristics of the C6711D Processor C6711DDevice compatibility Functional block and CPU DSP core diagram Digital Signal ProcessorCPU DSP core description DA2 ST1DA1 ST2Memory Block Description Block Size Bytes HEX Address Range Memory map summaryTMS320C6711D Memory Map Summary L2 Cache Registers Peripheral register descriptionsEmif Registers HEX Address Range Acronym Register NameEdma Parameter RAM† Interrupt Selector RegistersDevice Registers HEX Address Range Acronym Register Name CommentsEdma Registers Quick DMA Qdma and Pseudo Registers†HPI Registers PLL Controller RegistersGpio Registers McBSP0 and McBSP1 Registers Timer 0 and Timer 1 RegistersHEX Address Range Acronym Register Name Comments Timer McBSP0 McBSP1Signal groups description CE1 CE3CE2 CE0CLKOUT2/GP2 GpioGP7EXTINT7 GP6EXTINT6 GP5EXTINT5 GP4EXTINT4 General-Purpose Input/Output Gpio PortDevice Configurations Device configurations at device resetCLKMODE0 Configuration GDP/ZDP Functional Description PINBOOTMODE‡ BIT # Name Description Devcfg register descriptionEksrc Terminal Functions IPD Description Name GDP IPU‡ ZDP PIN SignalTerminal Functions Resets and Interrupts IPD Description Name GDP IPU‡ ZDP Jtag EmulationLittle Endian IPD Description Name GDP IPU‡ ZDP HOST-PORT Interface HPIUsed for transfer of data, address, and control HD12Emif − ASYNCHRONOUS/SYNCHRONOUS Memory Control ¶ Only one asserted during any external data accessDecoded from the two lowest bits of the internal address IPD Description Name GDP IPU‡ ZDP Emif − Address ¶ EA9 EA8 EA7 EA6 EA5 EA4 EA3 EA2IPD Description Name GDP IPU‡ ZDP Emif − Data ¶ Multichannel Buffered Serial Port 1 McBSP1Multichannel Buffered Serial Port 0 McBSP0 GENERAL-PURPOSE INPUT/OUTPUT Gpio ModuleRSV IPD RSVRSV IPU Cvdd Name GDP ZDP Supply Voltage PinsDvdd Supply voltage See NoteVSS Description Name GDP ZDP Supply Voltage PinsGround Pins GNDPIN Signal TYPE† Description Name GDP ZDP Ground Pins VSSDescription Name GDP ZDP Ground Pins VSS GNDHardware Development Tools Development supportSoftware Development Tools Fully qualified production device Device supportDevice and development-support tool nomenclature Device Speed Range Device Family Temperature Range Default 0 C to 90 CPrefix TechnologyDocumentation support Pwrd CPU CSR register descriptionRevision ID PCC DCC Pgie GIEPCC CPU CSR Register Bit Field DescriptionCPU ID L2MODE Cache configuration Ccfg register descriptionCcfg Register Bit Field Description DSP Interrupts Interrupt Selector DSP Interrupt Default Selector Module ControlInterrupt sources and interrupt selector EventEdma Selector Edma module and Edma selectorEdma Channels ESEL1 Register 0x01A0 FF04 ESEL3 Register 0x01A0 FF0CPLL and PLL controller Enabled or Disabled PLL Lock and Reset TimesClkout Signals, Default Settings, and Control MIN TYP MAX UnitGDPA−167, ZDPA-167 Clock SignalPLL Clock Frequency Ranges†‡ Pllcsr Register 0x01B7 C100 PLL Control/Status Register PllcsrPllm Register 0x01B7 C110 PLL Multiplier Control Register PllmDxEN OD1EN OSCDIV1 Register 0x01B7 C124Oscillator Divider 1 Register OSCDIV1 DIR General-purpose input/output GpioGP7 GP6 GP5 GP4 GP2 Power-down mode logic Pwrd Field of the CSR Register PD3 PD2 PD1System-level design considerations Power-supply sequencingCharacteristics of the Power-Down Modes ModeDvdd Power-supply decouplingPower-supply design considerations DSP Cvdd VSS GNDIeee 1149.1 Jtag compatibility statement Emif device speed Example Boards and Maximum Emif SpeedED3124 BE3 ED2316 BE2 ED158 BE1 ED70 BE0 Emif big endian mode correctnessEmif Data Lines Pins Where Data Present Bootmode ResetIOH Recommended operating conditions‡MIN NOM MAX Unit Parameter Test Conditions MIN TYP MAX Unit IOZTester Pin Electronics Signal transition levelsParameter Measurement Information Output Under TestAC transient rise/fall time specifications = 0.3 tcmax† VIL max VUS max GroundTiming parameters and board routing analysis Output from DSP Control Signals † Output from DSPBoard-Level Timings Example see Figure Timing requirements for Clkin †‡§ PLL Mode Bypass Mode UnitInput and Output Clocks See FigureClkin CLKOUT3 GDPA-167Parameter −200 Timing requirements for ECLKIN† see FigureGDPA-167 ZDPA−167 −250See −Figure Asynchronous Memory TimingTiming requirements for asynchronous memory cycles†‡§ AreAOE/SDRAS/SSOE † Setup = Strobe = Not ReadyCEx BE30 EA212 Address ED310 Read Data AWE/SDWE/SSWE † ArdyAOE/SDRAS/SSOE † ARE/SDCAS/SSADS † AWE/SDWE/SSWE † Ardy Setup = Strobe = Not Ready Hold =CEx BE30 EA212 SYNCHRONOUS-BURST Memory Timing Timing requirements for synchronous-burst Sram cycles†EA212 ED310 CEx BE30BE1 BE2 BE3 BE4 ARE/SDCAS/SSADS† AOE/SDRAS/SSOE† AWE/SDWE/SSWE†Synchronous Dram Timing Timing requirements for synchronous Dram cycles† see FigureAOE/SDRAS/SSOE † ARE/SDCAS/SSADS† AWE/SDWE/SSWE† Read EclkoutEA2113 Bank EA112 Column EA12 ED310 EA12 ED310 Write EclkoutEA2113 AOE/SDRAS/SSOE † ARE/SDCAS/SSADS † AWE/SDWE/SSWE †AOE/SDRAS/SSOE† ARE/SDCAS/SSADS† AWE/SDWE/SSWE† Actv EclkoutCEx BE30 EA2113 Bank Activate EA112 Row Address EA12 ED310 Dcab EclkoutRefr Eclkout Deac EclkoutCEx BE30 EA2113 Bank EA112 EA12 ED310 CEx BE30 EA212 EA12 ED310MRS Eclkout CEx BE30 EA212 MRS value ED310Hold Holda HOLD/HOLDA TimingTiming requirements for See Figure HOLD/HOLDA cycles† Busreq Timing Eclkout BusreqCLKMODE0 = Reset TimingTiming requirements for reset†‡ see Figure Emif Z Group† Emif Low Group† Group 2† Boot and Device PhaseClkin Eclkin Reset EXTINT, NMI External Interrupt TimingTiming requirements for external interrupts† see Figure Hstrobe HOST-PORT Interface TimingGDPA−167 Hstrobe HrdyHCS Hrdy Has † HasHR/W Hhwil Hstrobe † HCS HR/W Hhwil Hstrobe ‡ HCSHD150 input 1st half-word 2nd half-word HD150 input 1st halfword 2nd halfwordHrdy −1 ¶ Multichannel Buffered Serial Port Timing Bitn-1 Clks ClkrFSR int ClkxFSR external CLKR/X no need to resync CLKR/X needs resync Timing requirements for FSR when Gsync = 1 see FigureClks Master Slave MIN MAXBit Bitn-1 MASTER§ Slave MINClkx FSX MASTER§ Slave MIN MAX GDPA-167 McBSP Timing as SPI Master or Slave Clkstp = 10b, Clkxp = McBSP Timing as SPI Master or Slave Clkstp = 11b, Clkxp = TINPx TOUTx Timer TimingTiming requirements for timer inputs† GPIx GPOx GENERAL-PURPOSE INPUT/OUTPUT Gpio Port TimingTiming requirements for Gpio inputs†‡ Timing requirements for Jtag test port see Figure DTCKL-TDOV Delay time, TCK low to TDO validJtag TEST-PORT Timing TCK TDO TDI/TMS/TRSTThermal resistance characteristics S-PBGA package for ZDP Package thermal resistance characteristicsThermal resistance characteristics S-PBGA package for GDP Mechanical DataMSL Peak Temp Orderable Device Status Package Pins Package Eco PlanPackaging Information QtyGDP S-PBGA-N272 Seating Plane 4204396/A 04/02ZDP S-PBGA-N272 Seating Plane 4204398/A 04/02Important Notice