PACKAGE OPTION ADDENDUM

www.ti.com

14-Nov-2005

 

 

PACKAGING INFORMATION

Orderable Device

Status (1)

Package

Package

Pins Package

Eco Plan (2)

Lead/Ball Finish

MSL Peak Temp (3)

 

 

Type

Drawing

 

Qty

 

 

 

TMS320C6711DGDP200

ACTIVE

BGA

GDP

272

40

TBD

SNPB

Level-3-220C-168HR

TMS320C6711DGDP250

ACTIVE

BGA

GDP

272

1

TBD

SNPB

Level-3-220C-168HR

 

 

 

 

 

 

 

 

 

TMS320C6711DZDP200

ACTIVE

BGA

ZDP

272

40

Pb-Free

SNAGCU

Level-3-260C-168HR

 

 

 

 

 

 

(RoHS)

 

 

TMS32C6711DGDPA167

ACTIVE

BGA

GDP

272

40

TBD

SNPB

Level-3-220C-168HR

 

 

 

 

 

 

 

 

 

(1)The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2)Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

(3)MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 1

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Motorola TMS320C6711D Packaging Information, Orderable Device Status Package Pins Package Eco Plan, MSL Peak Temp, Qty