SYNCHRONOUS-BURST Memory Timing | Motorola TMS320C6711D guide

SPRS292A − OCTOBER 2005 − REVISED NOVEMBER 2005

SYNCHRONOUS-BURST MEMORY TIMING

timing requirements for synchronous-burst SRAM cycles†			(see Figure 29)
				GDPA-167
				ZDPA−167
NO.				−200		UNIT
				−250
				MIN	MAX

6	tsu(EDV-EKOH)	Setup time, read EDx valid before ECLKOUT high		1.5		ns
7	th(EKOH-EDV)	Hold time, read EDx valid after ECLKOUT high		2.5		ns

†The SBSRAM interface takes advantage of the internal burst counter in the SBSRAM. Accesses default to incrementing 4-word bursts, but random bursts and decrementing bursts are done by interrupting bursts in progress. All burst types can sustain continuous data flow.

switching characteristics over recommended operating conditions for synchronous-burst SRAM cycles†‡ (see Figure 29 and Figure 30)

GDPA-167

ZDPA−167

NO.

PARAMETER

−200

UNIT

−250

MIN

MAX

1

td(EKOH-CEV)

Delay time, ECLKOUT high to

valid

1.2

7

ns

CEx

2

td(EKOH-BEV)

Delay time, ECLKOUT high to

valid

7

ns

BEx

3

td(EKOH-BEIV)

Delay time, ECLKOUT high to

invalid

1.2

ns

BEx

4

td(EKOH-EAV)

Delay time, ECLKOUT high to EAx valid

7

ns

5

td(EKOH-EAIV)

Delay time, ECLKOUT high to EAx invalid

1.2

ns

8

td(EKOH-ADSV)

Delay time, ECLKOUT high to

1.2

7

ns

ARE/SDCAS/SSADS valid

9

td(EKOH-OEV)

Delay time, ECLKOUT high to,

1.2

7

ns

AOE/SDRAS/SSOE valid

10

td(EKOH-EDV)

Delay time, ECLKOUT high to

valid

7

ns

EDx

11

td(EKOH-EDIV)

Delay time, ECLKOUT high to

invalid

1.2

ns

EDx

12

td(EKOH-WEV)

Delay time, ECLKOUT high to

1.2

7

ns

AWE/SDWE/SSWE valid

†The SBSRAM interface takes advantage of the internal burst counter in the SBSRAM. Accesses default to incrementing 4-word bursts, but random bursts and decrementing bursts are done by interrupting bursts in progress. All burst types can sustain continuous data flow.

‡ARE/SDCAS/SSADS, AOE/SDRAS/SSOE, and AWE/SDWE/SSWE operate as SSADS, SSOE, and SSWE, respectively, during SBSRAM accesses.

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Motorola TMS320C6711D warranty SYNCHRONOUS-BURST Memory Timing, Timing requirements for synchronous-burst Sram cycles†

Contents

SPRS292A − October 2005 − Revised November Table of Contents Multichannel Buffered Serial Port Timing Revision HistoryPages ADDITIONS/CHANGES/DELETIONS Bottom View GDP and ZDP BGA packages bottom viewGDP and ZDP 272-PIN Ball Grid Array BGA PACKAGES† Description Hardware Features Internal Clock Device characteristicsCharacteristics of the C6711D Processor C6711D Device compatibility Functional block and CPU DSP core diagram Digital Signal Processor CPU DSP core description DA2 ST1DA1 ST2 Memory Block Description Block Size Bytes HEX Address Range Memory map summaryTMS320C6711D Memory Map Summary L2 Cache Registers Peripheral register descriptionsEmif Registers HEX Address Range Acronym Register Name Edma Parameter RAM† Interrupt Selector RegistersDevice Registers HEX Address Range Acronym Register Name Comments Edma Registers Quick DMA Qdma and Pseudo Registers† HPI Registers PLL Controller RegistersGpio Registers McBSP0 and McBSP1 Registers Timer 0 and Timer 1 RegistersHEX Address Range Acronym Register Name Comments Timer McBSP0 McBSP1 Signal groups description CE1 CE3CE2 CE0 CLKOUT2/GP2 GpioGP7EXTINT7 GP6EXTINT6 GP5EXTINT5 GP4EXTINT4 General-Purpose Input/Output Gpio Port Device Configurations Device configurations at device reset CLKMODE0 Configuration GDP/ZDP Functional Description PINBOOTMODE‡ BIT # Name Description Devcfg register descriptionEksrc Terminal Functions IPD Description Name GDP IPU‡ ZDP PIN SignalTerminal Functions Resets and Interrupts IPD Description Name GDP IPU‡ ZDP Jtag Emulation Little Endian IPD Description Name GDP IPU‡ ZDP HOST-PORT Interface HPIUsed for transfer of data, address, and control HD12 Emif − ASYNCHRONOUS/SYNCHRONOUS Memory Control ¶ Only one asserted during any external data accessDecoded from the two lowest bits of the internal address IPD Description Name GDP IPU‡ ZDP Emif − Address ¶ EA9 EA8 EA7 EA6 EA5 EA4 EA3 EA2 IPD Description Name GDP IPU‡ ZDP Emif − Data ¶ Multichannel Buffered Serial Port 1 McBSP1 Multichannel Buffered Serial Port 0 McBSP0 GENERAL-PURPOSE INPUT/OUTPUT Gpio Module RSV IPD RSVRSV IPU Cvdd Name GDP ZDP Supply Voltage PinsDvdd Supply voltage See Note VSS Description Name GDP ZDP Supply Voltage PinsGround Pins GND PIN Signal TYPE† Description Name GDP ZDP Ground Pins VSS Description Name GDP ZDP Ground Pins VSS GND Hardware Development Tools Development supportSoftware Development Tools Fully qualified production device Device supportDevice and development-support tool nomenclature Device Speed Range Device Family Temperature Range Default 0 C to 90 CPrefix Technology Documentation support Pwrd CPU CSR register descriptionRevision ID PCC DCC Pgie GIE PCC CPU CSR Register Bit Field DescriptionCPU ID L2MODE Cache configuration Ccfg register descriptionCcfg Register Bit Field Description DSP Interrupts Interrupt Selector DSP Interrupt Default Selector Module ControlInterrupt sources and interrupt selector Event Edma Selector Edma module and Edma selectorEdma Channels ESEL1 Register 0x01A0 FF04 ESEL3 Register 0x01A0 FF0C PLL and PLL controller Enabled or Disabled PLL Lock and Reset TimesClkout Signals, Default Settings, and Control MIN TYP MAX Unit GDPA−167, ZDPA-167 Clock SignalPLL Clock Frequency Ranges†‡ Pllcsr Register 0x01B7 C100 PLL Control/Status Register Pllcsr Pllm Register 0x01B7 C110 PLL Multiplier Control Register Pllm DxEN OD1EN OSCDIV1 Register 0x01B7 C124Oscillator Divider 1 Register OSCDIV1 DIR General-purpose input/output GpioGP7 GP6 GP5 GP4 GP2 Power-down mode logic Pwrd Field of the CSR Register PD3 PD2 PD1 System-level design considerations Power-supply sequencingCharacteristics of the Power-Down Modes Mode Dvdd Power-supply decouplingPower-supply design considerations DSP Cvdd VSS GND Ieee 1149.1 Jtag compatibility statement Emif device speed Example Boards and Maximum Emif Speed ED3124 BE3 ED2316 BE2 ED158 BE1 ED70 BE0 Emif big endian mode correctnessEmif Data Lines Pins Where Data Present Bootmode Reset IOH Recommended operating conditions‡MIN NOM MAX Unit Parameter Test Conditions MIN TYP MAX Unit IOZ Tester Pin Electronics Signal transition levelsParameter Measurement Information Output Under Test AC transient rise/fall time specifications = 0.3 tcmax† VIL max VUS max Ground Timing parameters and board routing analysis Output from DSP Control Signals † Output from DSPBoard-Level Timings Example see Figure Timing requirements for Clkin †‡§ PLL Mode Bypass Mode UnitInput and Output Clocks See Figure Clkin CLKOUT3 GDPA-167Parameter −200 Timing requirements for ECLKIN† see FigureGDPA-167 ZDPA−167 −250 See −Figure Asynchronous Memory TimingTiming requirements for asynchronous memory cycles†‡§ Are AOE/SDRAS/SSOE † Setup = Strobe = Not ReadyCEx BE30 EA212 Address ED310 Read Data AWE/SDWE/SSWE † Ardy AOE/SDRAS/SSOE † ARE/SDCAS/SSADS † AWE/SDWE/SSWE † Ardy Setup = Strobe = Not Ready Hold =CEx BE30 EA212 SYNCHRONOUS-BURST Memory Timing Timing requirements for synchronous-burst Sram cycles† EA212 ED310 CEx BE30BE1 BE2 BE3 BE4 ARE/SDCAS/SSADS† AOE/SDRAS/SSOE† AWE/SDWE/SSWE† Synchronous Dram Timing Timing requirements for synchronous Dram cycles† see Figure AOE/SDRAS/SSOE † ARE/SDCAS/SSADS† AWE/SDWE/SSWE† Read EclkoutEA2113 Bank EA112 Column EA12 ED310 EA12 ED310 Write EclkoutEA2113 AOE/SDRAS/SSOE † ARE/SDCAS/SSADS † AWE/SDWE/SSWE † AOE/SDRAS/SSOE† ARE/SDCAS/SSADS† AWE/SDWE/SSWE† Actv EclkoutCEx BE30 EA2113 Bank Activate EA112 Row Address EA12 ED310 Dcab Eclkout Refr Eclkout Deac EclkoutCEx BE30 EA2113 Bank EA112 EA12 ED310 CEx BE30 EA212 EA12 ED310 MRS Eclkout CEx BE30 EA212 MRS value ED310 Hold Holda HOLD/HOLDA TimingTiming requirements for See Figure HOLD/HOLDA cycles† Busreq Timing Eclkout Busreq CLKMODE0 = Reset TimingTiming requirements for reset†‡ see Figure Emif Z Group† Emif Low Group† Group 2† Boot and Device PhaseClkin Eclkin Reset EXTINT, NMI External Interrupt TimingTiming requirements for external interrupts† see Figure Hstrobe HOST-PORT Interface TimingGDPA−167 Hstrobe Hrdy HCS Hrdy Has † HasHR/W Hhwil Hstrobe † HCS HR/W Hhwil Hstrobe ‡ HCS HD150 input 1st half-word 2nd half-word HD150 input 1st halfword 2nd halfwordHrdy −1 ¶ Multichannel Buffered Serial Port Timing Bitn-1 Clks ClkrFSR int Clkx FSR external CLKR/X no need to resync CLKR/X needs resync Timing requirements for FSR when Gsync = 1 see FigureClks Master Slave MIN MAX Bit Bitn-1 MASTER§ Slave MINClkx FSX MASTER§ Slave MIN MAX GDPA-167 McBSP Timing as SPI Master or Slave Clkstp = 10b, Clkxp = McBSP Timing as SPI Master or Slave Clkstp = 11b, Clkxp = TINPx TOUTx Timer TimingTiming requirements for timer inputs† GPIx GPOx GENERAL-PURPOSE INPUT/OUTPUT Gpio Port TimingTiming requirements for Gpio inputs†‡ Timing requirements for Jtag test port see Figure DTCKL-TDOV Delay time, TCK low to TDO validJtag TEST-PORT Timing TCK TDO TDI/TMS/TRST Thermal resistance characteristics S-PBGA package for ZDP Package thermal resistance characteristicsThermal resistance characteristics S-PBGA package for GDP Mechanical Data MSL Peak Temp Orderable Device Status Package Pins Package Eco PlanPackaging Information Qty GDP S-PBGA-N272 Seating Plane 4204396/A 04/02 ZDP S-PBGA-N272 Seating Plane 4204398/A 04/02 Important Notice