DIMM Type | DIMMs Populated/ | Operating Frequency (in | Maximum DIMM Rank/Channel |
| Channel | MT/s) |
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| 1.2 V |
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RDIMM | 1 | 2133, 1866, 1600, 1333 | Dual rank or single rank |
| 2 | 2133, 1866, 1600, 1333 | Dual rank or single rank |
General memory module installation guidelines
This system supports flexible memory configuration, enabling the system to be configured and run in any valid chipset architectural configuration. The following are the recommended guidelines for installing memory modules:
•x4 and x8 DRAM based memory modules can be mixed. For more information, see
•Up to two dual- or
•Populate memory module sockets only if a processor is installed. For
•Populate all sockets with white release tabs first and then the black release tabs.
•Populate the sockets by the highest rank count, in the following
•When mixing memory modules with different capacities, populate the sockets with memory modules with the highest capacity first. For example, if you want to mix 4 GB and 8 GB memory modules, populate 8 GB memory modules in the sockets with white release tabs and 4 GB memory modules in the sockets with black release tabs.
•In a
•Memory modules of different capacities can be mixed provided other memory population rules are followed (for example, 4 GB and 8 GB memory modules can be mixed).
•Mixing of more than two memory module capacities in a system is not supported.
•Populate two memory modules per processor (one memory module per channel) at a time to maximize performance.
Mode-specific guidelines
Four memory channels are allocated to each processor. The allowable configurations depend on the memory mode selected.
NOTE: You can mix x4 and x8 DRAM based DIMMs to support RAS features. However, all guidelines for specific RAS features must be followed. x4 DRAM based DIMMs retain Single Device Data Correction (SDDC) in memory optimized (independent channel) mode. x8 DRAM based DIMMs require Advanced ECC mode to gain SDDC.
The following sections provide additional slot population guidelines for each mode:
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