door installation back, 79 front, 79
DP rated power cables, 20
dual
E
cell board, 110 electrical specifications, 50 electrostatic discharge, 59 EMI panel
installing, 111 removing, 89
environmental requirements, 54 equipment
returning, 71
equipment footprint templates, 185 external
F
facility guidelines computer room layout, 185 equipment footprint templates, 185
FEPS, 19 description, 20
firmware
ACPI interface, 44, 46 EFI interface, 44, 46 event IDs, 44, 46 PAL interface, 44, 46 POSSE shell, 44, 46 SAL interface, 44, 46
front end power supply, (see FEPS) front panel display, 179
G
gateway address, 100
global shared memory errors, 48 Gold Book, 112
H
halfdome utility connector board, (see HUCB) hardware correctable errors, 48
HKP LED, 179
front panel display, 96 HKP LED, 96 turning on, 96, 178
housekeeping power LED, 96, 179
HSO
detailed description, 28 LED status indications, 28 location on backplane, 29 part of clock subsystem, 27
HUCB
DIP switch purpose, 18, 24 general description, 25 shown outside system, 25
humidity specifications, 54
I
I/O subsystem detailed description, 37 enhanced rope definition, 37 fat rope definition, 37
illustrated I/O backplane slot mapping, 39
SBA chip operation, 38, 39 inspecting
cables, 112
circuit boards, 112 installation
EMI panel, 111 PDCA, 86
tools required for, 63 visual inspection, 110
intake air filter, 18 interference
communications, 59 inventory check, 60 IP address
default values, 99
LAN configuration screen, 100 setting private and customer LAN, 99
J
JET
invoking the software, 108 power cycling after usage, 108 purpose for invoking, 108
JTAG utility for scan test JUST, 108
JUST
JTAG utility for scan test, 108
K
kick plates
attaching to cabinet, 109 shown on cabinet, 109
L
LAN
port 0, 100 port 1, 100 status, 100
LED
AC0 Present, 98, 180
AC1 Present, 98, 180 Attention, 179
HKP (housekeeping), 96, 179 Present, 96, 179
leveling feet attaching, 79
local power monitors, (see LPM)
198 Index
